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LM3S1J16-IQR50-C3T

Texas Instruments

LM3S1J16-IQR50-C3T by Texas Instruments

LM3S1J16-IQR50-C3T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 20480 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing and control. With features like ADC channels, DMA channels, and PWM channels, it offers versatile functionality in a compact package style ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,688 parts In-Stock

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5,688

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Digiode

USA . 197 parts In-Stock

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197

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 801 parts In-Stock

1+ parts

$9.580

100+ parts

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801

$9.580

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One Stop Electronics

USA . 134 parts In-Stock

1+ parts

$29.000

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134

$29.000

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Parana Technologies

USA . 1,934 parts In-Stock

1+ parts

$72.186

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1,934

$72.186

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DigiPath Technology Company

USA . 1,139 parts In-Stock

1+ parts

$79.486

100+ parts

$73.127

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1,139

$79.486

$73.127

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ChromeModa Solutions

Germany . 6,949 parts In-Stock

1+ parts

$81.108

100+ parts

$66.509

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6,949

$81.108

$66.509

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IDEA Electronic Components Group

UK . 1,853 parts In-Stock

1+ parts

$81.108

100+ parts

$77.053

1k+ parts

$72.997

10k+ parts

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1,853

$81.108

$77.053

$72.997

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Corphita

USA . 2,431 parts In-Stock

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2,431

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Microchip USA

USA . 335 parts In-Stock

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335

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Overview

Unlock the power of innovation with the LM3S1J16-IQR50-C3T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This microcontroller is designed for a wide range of applications, offering unparalleled performance and versatility. Whether you are developing a new project or upgrading an existing one, this product provides customers with exceptional value, efficiency, and seamless integration. Stay ahead of the competition and bring your ideas to life with the LM3S1J16-IQR50-C3T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product more resistant to damage during handling and shipping.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, reducing overall manufacturing costs.

Maximum Supply Voltage: 3.6 V

The higher supply voltage allows for increased performance and capabilities in the microcontroller.

Package Shape: SQUARE

The square package shape is commonly used and allows for easy integration into various electronic designs.

Bit Size: 32

The 32-bit architecture provides higher processing power and performance compared to lower bit sizes.

Power Supplies (V): 1.2,3.3

Having multiple power supply options allows for flexibility in various power scenarios and applications.

No. of Terminals: 64

The higher number of terminals provides more connectivity options for peripherals and external components.

Package Style (Meter): FLATPACK

The flatpack style is space-saving and allows for efficient use of board space in electronic designs.

Minimum Supply Voltage: 3 V

The lower minimum supply voltage helps in reducing power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the product suitable for industrial applications where elevated temperatures are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in harsh environmental conditions.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and signals, expanding its application capabilities.

DMA Channels: YES

DMA channels enable direct memory access, improving data transfer speeds and reducing processor load for higher efficiency.

Terminal Position: QUAD

Quad terminal position provides easy soldering and secure connections, ensuring reliable electrical performance.

ROM Words: 131072

The large ROM capacity allows for storing a significant amount of program data and instructions for complex applications.

Maximum Seated Height: 1.6 mm

The low seated height ensures compatibility with slim and compact electronic designs, saving space in the overall product.

Width: 10 mm

The compact width dimensions make the microcontroller suitable for smaller form factor devices and applications.

Maximum Clock Frequency: 16 MHz

The high clock frequency enables fast processing speeds and efficient execution of tasks in real-time applications.

Length: 10 mm

The small length dimensions contribute to the overall compact size of the microcontroller, making it ideal for space-constrained designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER

The microcontroller type indicates that the product is specifically designed for embedded control applications, offering optimized performance and capabilities.

RAM Bytes: 20480

The ample RAM capacity allows for efficient data processing and storage, enhancing the overall performance of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for battery-powered and noise-sensitive applications.

Terminal Form: GULL WING

The gull-wing terminal form provides reliable solder connections and ease of handling during assembly, ensuring robust electrical connections.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage specifies the typical operating voltage for the microcontroller, ensuring compatibility with standard power sources.

PWM Channels: YES

Having PWM channels enables precise control of digital signals, making the microcontroller suitable for applications requiring accurate signal modulation.

ROM Programmability: FLASH

The flash ROM programmability allows for efficient and easy reprogramming of the microcontroller, facilitating rapid development and updates in applications.

Terminal Pitch: 0.5 mm

The small terminal pitch makes the microcontroller compatible with fine-pitch PCB designs, enabling high-density integration in electronic assemblies.

Speed: 50 rpm

The specified speed parameter may not be relevant for a microcontroller product and could be a mistake in the technical specifications.

No. of I/O Lines: 33

The sufficient number of I/O lines allows for versatile connectivity and interfacing with external devices, enhancing the product’s application flexibility.

Technical Specifications

Microcontrollers LM3S1J16-IQR50-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1J16-IQR50-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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