Loading...

LM3S1J16-IQR50-C3

Texas Instruments

LM3S1J16-IQR50-C3 by Texas Instruments

LM3S1J16-IQR50-C3 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 20480 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring ADC and DMA channels, as well as PWM functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,813 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,813

-

-

-

-

Digiode

USA . 4,247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,247

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 204 parts In-Stock

1+ parts

$11.305

100+ parts

-

1k+ parts

-

10k+ parts

-

204

$11.305

-

-

-

One Stop Electronics

USA . 616 parts In-Stock

1+ parts

$21.000

100+ parts

-

1k+ parts

-

10k+ parts

-

616

$21.000

-

-

-

Parana Technologies

USA . 93 parts In-Stock

1+ parts

$28.451

100+ parts

-

1k+ parts

$47.651

10k+ parts

-

93

$28.451

-

$47.651

-

DigiPath Technology Company

USA . 2,057 parts In-Stock

1+ parts

$31.328

100+ parts

$28.821

1k+ parts

-

10k+ parts

-

2,057

$31.328

$28.821

-

-

ChromeModa Solutions

Germany . 4,583 parts In-Stock

1+ parts

$31.967

100+ parts

$26.213

1k+ parts

-

10k+ parts

-

4,583

$31.967

$26.213

-

-

IDEA Electronic Components Group

UK . 485 parts In-Stock

1+ parts

$31.967

100+ parts

$30.369

1k+ parts

$28.770

10k+ parts

-

485

$31.967

$30.369

$28.770

-

Corphita

USA . 4,587 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,587

-

-

-

-

Microchip USA

USA . 213 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

213

-

-

-

-

Overview

Unlock the power of innovation with the LM3S1J16-IQR50-C3 by Texas Instruments. This cutting-edge microcontroller offers unmatched quality and reliability, thanks to the legendary reputation of its manufacturer. Ideal for a wide range of applications, from industrial automation to consumer electronics, this product delivers exceptional value and performance. Experience seamless integration, superior functionality, and endless possibilities with the LM3S1J16-IQR50-C3 – the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the microcontroller suitable for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltage, making it versatile for various power supply configurations.

Package Shape: SQUARE

Square shape provides uniformity and ease of mounting onto circuit boards.

Bit Size: 32

32-bit architecture allows for high processing capability, suitable for demanding applications.

No. of Terminals: 64

Ample number of terminals provide flexibility for interfacing with external components and peripherals.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in cold environments without compromising performance.

ADC Channels: YES

Built-in ADC channels enable analog signal processing, expanding the range of applications the microcontroller can handle.

DMA Channels: YES

Support for DMA channels enhances data transfer speed and efficiency, improving overall system performance.

ROM Words: 131072

Large ROM capacity allows for storing a substantial amount of program code and data for complex applications.

RAM Bytes: 20480

Generous RAM size provides ample memory space for data processing, multitasking, and temporary storage.

Peripheral IC Type: MICROCONTROLLER

Specialized IC designed specifically for microcontroller applications ensures optimal performance and compatibility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller.

PWM Channels: YES

Pulse Width Modulation (PWM) channels allow for precise control of analog signals, essential for applications like motor control and LED dimming.

ROM Programmability: FLASH

Flash ROM allows for in-system programming and updating of firmware, making the microcontroller easily reconfigurable and future-proof.

Technical Specifications

Microcontrollers LM3S1J16-IQR50-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1J16-IQR50-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20