Loading...

LM3S1J11-IQC50-C1T

Texas Instruments

LM3S1J11-IQC50-C1T by Texas Instruments

Texas Instruments' LM3S1J11-IQC50-C1T microcontroller features 32-bit architecture, 131072 ROM words, and 20480 RAM bytes. With ADC and DMA channels, it operates in industrial temperatures (-40 to 85 °C) for various applications like PWM control and data acquisition.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,503

-

-

-

-

Digiode

USA . 2,534 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,534

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 761 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

761

$2.000

-

-

-

AZTECH Wire

Italy . 448 parts In-Stock

1+ parts

$8.880

100+ parts

-

1k+ parts

-

10k+ parts

-

448

$8.880

-

-

-

Parana Technologies

USA . 2,130 parts In-Stock

1+ parts

$61.222

100+ parts

-

1k+ parts

-

10k+ parts

-

2,130

$61.222

-

-

-

ChromeModa Solutions

Germany . 5,748 parts In-Stock

1+ parts

$68.789

100+ parts

$56.407

1k+ parts

-

10k+ parts

-

5,748

$68.789

$56.407

-

-

IDEA Electronic Components Group

UK . 722 parts In-Stock

1+ parts

$68.789

100+ parts

$65.350

1k+ parts

$61.910

10k+ parts

-

722

$68.789

$65.350

$61.910

-

Corphita

USA . 3,329 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,329

-

-

-

-

DigiPath Technology Company

USA . 458 parts In-Stock

1+ parts

-

100+ parts

$62.020

1k+ parts

-

10k+ parts

-

458

-

$62.020

-

-

Microchip USA

USA . 294 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

294

-

-

-

-

Overview

Experience the cutting-edge technology of the LM3S1J11-IQC50-C1T microcontroller from Texas Instruments, a leader in semiconductor manufacturing. Designed for industrial applications, this powerful 32-bit device offers 131072 ROM words, 20480 RAM bytes, and 67 I/O lines for seamless integration into your projects. With a wide operating temperature range and low power consumption, this microcontroller provides high performance and reliability. Trust in Texas Instruments to deliver quality products that exceed expectations. Upgrade your systems with the LM3S1J11-IQC50-C1T and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the microcontroller.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.32 V

Allows for a higher input voltage range, making the microcontroller compatible with a variety of power sources.

Package Shape: SQUARE

Offers a compact and space-efficient design for easy integration into electronic devices.

Bit Size: 32

Provides a higher computing power and processing capability for handling complex tasks efficiently.

Power Supplies (V): 1.2,3.3

Offers flexibility in power options, allowing the microcontroller to operate at different voltage levels as per the application requirements.

No. of Terminals: 100

Provides ample connectivity options for interfacing with various external components and peripherals.

Package Style (Meter): FLATPACK

Ensures easy installation and secure mounting onto circuit boards, enhancing the overall reliability of the product.

Minimum Supply Voltage: 1.08 V

Allows for reliable operation even at lower input voltage levels, ensuring consistent performance.

Maximum Operating Temperature: 85 °C

Provides a wide temperature range for operation, making the microcontroller suitable for industrial applications where heat resistance is essential.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in extremely low temperature environments, enhancing the product's usability in various conditions.

ADC Channels: YES

Enables analog-to-digital conversion, facilitating the integration of analog sensors and signals into digital systems.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer and processing, improving overall system performance.

Terminal Position: QUAD

Allows for easy and organized connection of external devices, enhancing the overall usability of the microcontroller.

ROM Words: 131072

Offers ample storage capacity for program code and data, enabling the implementation of complex algorithms and functions.

Maximum Seated Height: 1.6 mm

Provides a low-profile design for compact electronic devices, saving space and enabling sleek product designs.

Width: 14 mm

Compact dimensions facilitate integration into smaller electronic devices, making it ideal for space-constrained applications.

Maximum Clock Frequency: 0.032 MHz

Provides high-speed processing capability for rapid execution of instructions and tasks, enhancing system performance.

Length: 14 mm

Compact form factor allows for easy integration into electronic designs with limited space, promoting versatile applications.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable performance in challenging conditions.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications, offering optimized performance and features for control and processing tasks.

RAM Bytes: 20480

Provides sufficient memory for data storage and manipulation, supporting multitasking and complex data processing requirements.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, enhancing energy efficiency and performance.

Terminal Form: GULL WING

Facilitates easy soldering and mounting onto circuit boards, ensuring reliable connections and ease of assembly.

Nominal Supply Voltage: 1.2 V

Optimal operating voltage for efficient performance and power consumption, maximizing energy efficiency.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of analog outputs, enabling accurate and flexible system operation.

ROM Programmability: FLASH

Utilizes Flash memory for reprogrammable storage of program code, allowing for easy updates and modifications.

Terminal Pitch: 0.5 mm

Provides fine pitch spacing for compact PCB layouts, enabling high-density mounting in space-constrained electronic designs.

Speed: 50 rpm

Offers high-speed processing capability for efficient execution of tasks, enhancing system performance and responsiveness.

No. of I/O Lines: 67

Provides ample input/output options for connecting external devices and peripherals, enabling versatile system integration.

Technical Specifications

Microcontrollers LM3S1J11-IQC50-C1T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1J11-IQC50-C1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20