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LM3S1D21-IQC80-A2T

Texas Instruments

LM3S1D21-IQC80-A2T by Texas Instruments

LM3S1D21-IQC80-A2T by Texas Instruments is a 32-bit microcontroller with 524288 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 16.384 MHz, making it suitable for industrial applications requiring high-speed processing and control capabilities. With features like ADC and DMA channels, this microcontroller offers versatile functionality for various embedded systems projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,175 parts In-Stock

1+ parts

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8,175

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Digiode

USA . 2,773 parts In-Stock

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2,773

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 499 parts In-Stock

1+ parts

$9.872

100+ parts

-

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499

$9.872

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One Stop Electronics

USA . 1,136 parts In-Stock

1+ parts

$30.000

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1,136

$30.000

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Parana Technologies

USA . 879 parts In-Stock

1+ parts

$42.800

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879

$42.800

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DigiPath Technology Company

USA . 1,197 parts In-Stock

1+ parts

$47.128

100+ parts

$43.358

1k+ parts

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1,197

$47.128

$43.358

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ChromeModa Solutions

Germany . 2,461 parts In-Stock

1+ parts

$48.090

100+ parts

$39.434

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2,461

$48.090

$39.434

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IDEA Electronic Components Group

UK . 1,199 parts In-Stock

1+ parts

$48.090

100+ parts

$45.686

1k+ parts

$43.281

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1,199

$48.090

$45.686

$43.281

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Corphita

USA . 2,505 parts In-Stock

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2,505

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Microchip USA

USA . 262 parts In-Stock

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262

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Overview

Elevate your projects with the LM3S1D21-IQC80-A2T by Texas Instruments, a top-of-the-line microcontroller that boasts unparalleled quality and reliability. With cutting-edge technology from a trusted manufacturer, this device is perfect for a wide range of applications. Unlock endless possibilities with its advanced features, efficient performance, and seamless integration capabilities. Experience the value and benefits it brings to your designs with ease and precision. Trust in Texas Instruments for innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for higher voltage input which can be useful for certain applications requiring more power.

Bit Size: 32

A 32-bit size allows for more complex calculations and processing capabilities.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for compact and efficient integration on PCBs.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers high performance and efficiency for various applications.

ROM Words: 524288

With a large ROM capacity, the microcontroller can store a significant amount of program data.

RAM Bytes: 98304

Having a large RAM capacity enables efficient data storage and manipulation during operation.

Maximum Clock Frequency: 16.384 MHz

A high maximum clock frequency allows for fast processing and response times.

Technical Specifications

Microcontrollers LM3S1D21-IQC80-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1D21-IQC80-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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