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LM3S1D21-IQC80-A1T

Texas Instruments

LM3S1D21-IQC80-A1T by Texas Instruments

LM3S1D21-IQC80-A1T by Texas Instruments is a 32-bit microcontroller with 100 terminals, operating at a max frequency of 16.384 MHz. Ideal for industrial applications, it features ADC and DMA channels, PWM support, and operates b/w -40 to 85°C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,613 parts In-Stock

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7,613

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Digiode

USA . 4,179 parts In-Stock

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4,179

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 865 parts In-Stock

1+ parts

$13.000

100+ parts

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865

$13.000

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AZTECH Wire

Italy . 561 parts In-Stock

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$18.960

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561

$18.960

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Parana Technologies

USA . 1,343 parts In-Stock

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$35.297

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1,343

$35.297

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DigiPath Technology Company

USA . 2,278 parts In-Stock

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$38.866

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2,278

$38.866

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ChromeModa Solutions

Germany . 5,817 parts In-Stock

1+ parts

$39.659

100+ parts

$32.520

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5,817

$39.659

$32.520

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IDEA Electronic Components Group

UK . 615 parts In-Stock

1+ parts

$39.659

100+ parts

$37.676

1k+ parts

$35.693

10k+ parts

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615

$39.659

$37.676

$35.693

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Corphita

USA . 3,881 parts In-Stock

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3,881

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Microchip USA

USA . 461 parts In-Stock

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461

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Overview

Upgrade your projects with the LM3S1D21-IQC80-A1T microcontroller from Texas Instruments. With cutting-edge technology and unmatched reliability, Texas Instruments is a name you can trust. This microcontroller is perfect for a wide range of applications, offering high performance and versatility. Whether you're working on robotics, IoT devices, or industrial automation, this microcontroller delivers exceptional value, benefits, and advantages to meet all your needs. Trust Texas Instruments to bring innovation to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability for the microcontroller, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can operate efficiently within a safe voltage range, protecting it from damage.

Bit Size: 32

The 32-bit architecture provides high processing power and performance, suitable for handling complex tasks and computations effectively.

No. of Terminals: 100

Having 100 terminals allows for a higher degree of connectivity and interfacing options, expanding the range of possible applications for the microcontroller.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature (-40°C) ensures that the microcontroller can function reliably even in harsh environmental conditions.

Maximum Clock Frequency: 16.384 MHz

With a high maximum clock frequency of 16.384 MHz, this microcontroller can execute instructions quickly and efficiently, enhancing overall performance.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller provides simplified and efficient instruction execution, leading to faster processing speeds and improved performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable for long-term operation.

ROM Programmability: FLASH

The flash programmable ROM allows for easy and quick updates to the microcontroller's firmware, enabling flexibility and adaptability to changing requirements.

Technical Specifications

Microcontrollers LM3S1D21-IQC80-A1T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1D21-IQC80-A1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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