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LM3S1B21-IQC80-C3T

Texas Instruments

LM3S1B21-IQC80-C3T by Texas Instruments

LM3S1B21-IQC80-C3T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing and multiple ADC/DMA channels. With a compact square package style and low seated height of 1.6 mm, it offers efficient integration in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,497 parts In-Stock

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4,497

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Vyrian

USA . 2,721 parts In-Stock

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2,721

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Distributors (Availability)

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One Stop Electronics

USA . 452 parts In-Stock

1+ parts

$10.000

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452

$10.000

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AZTECH Wire

Italy . 800 parts In-Stock

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$12.132

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800

$12.132

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Parana Technologies

USA . 34 parts In-Stock

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$36.301

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34

$36.301

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DigiPath Technology Company

USA . 1,806 parts In-Stock

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$39.972

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$36.774

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1,806

$39.972

$36.774

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IDEA Electronic Components Group

UK . 2,258 parts In-Stock

1+ parts

$40.788

100+ parts

$38.749

1k+ parts

$36.709

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2,258

$40.788

$38.749

$36.709

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ChromeModa Solutions

Germany . 1,705 parts In-Stock

1+ parts

$40.788

100+ parts

$33.446

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1,705

$40.788

$33.446

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Corphita

USA . 829 parts In-Stock

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829

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Microchip USA

USA . 391 parts In-Stock

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Overview

Embark on a journey of innovation with the LM3S1B21-IQC80-C3T microcontroller by Texas Instruments. Crafted with precision and expertise, this powerful device opens up a world of possibilities across various applications. Seamlessly blending quality with functionality, this microcontroller offers unmatched value to customers seeking reliability and performance. Experience the benefits of cutting-edge technology and seamless operation, all within a compact and efficient package. Join the Texas Instruments family and elevate your projects to new heights with the LM3S1B21-IQC80-C3T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and resources during manufacturing.

Maximum Supply Voltage: 3.6 V

Can operate at a higher supply voltage, providing flexibility and compatibility with various power sources.

Bit Size: 32

32-bit processing capability allows for faster and more complex operations, making the microcontroller suitable for advanced applications.

Power Supplies (V): 1.2,3.3

Supports multiple power supply voltages, offering versatility in different usage scenarios.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK

Flatpack package style saves space and allows for a more compact design, ideal for applications with limited space constraints.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the microcontroller to function in cold environments without any issues.

ADC Channels: YES

Built-in ADC channels enable analog sensing and conversion, expanding the range of applications that the microcontroller can be used for.

DMA Channels: YES

DMA channels facilitate efficient data transfer between peripherals and memory, improving overall system performance.

ROM Words: 262144

Large ROM size allows for storing a significant amount of program data, enabling complex applications to be executed smoothly.

Maximum Seated Height: 1.6 mm

Low seated height makes the microcontroller suitable for slim and compact designs, saving space in the final product.

Width: 14 mm

Compact width dimension further contributes to space-saving design considerations in electronic applications.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for faster processing speeds, enhancing the overall performance of the microcontroller.

Peak Reflow Temperature °C: 260

Able to withstand high peak reflow temperatures, ensuring the microcontroller's reliability during manufacturing processes.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating makes the microcontroller suitable for use in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it is designed to efficiently control and monitor various external peripherals, making it a versatile component for embedded systems.

RAM Bytes: 98304

Generous RAM size enables efficient data processing and storage, supporting the execution of complex algorithms and tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections, ensuring stable operation in various environments.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable performance of the microcontroller.

PWM Channels: YES

Support for PWM channels allows for precise control of output signals, making the microcontroller suitable for motor control and other applications requiring pulse-width modulation.

ROM Programmability: FLASH

Flash ROM programmability enables easy and flexible firmware updates, improving the microcontroller's versatility and adaptability.

Terminal Pitch: 0.5 mm

Fine terminal pitch enhances connectivity options and facilitates compact PCB layouts in electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the microcontroller can withstand moderate exposure to moisture during storage and handling.

Speed: 80 rpm

Operates at a speed of 80 revolutions per minute, suitable for controlling rotational motion or timing applications.

No. of I/O Lines: 67

Having 67 I/O lines provides ample input and output options for interfacing with external devices, sensors, and peripherals.

Technical Specifications

Microcontrollers LM3S1B21-IQC80-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1B21-IQC80-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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