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LM3S1B21-IBZ80-C5T

Texas Instruments

LM3S1B21-IBZ80-C5T by Texas Instruments

LM3S1B21-IBZ80-C5T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring high-speed processing and control. With features like ADC and PWM channels, it offers versatile functionality in compact dimensions for efficient system integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,014 parts In-Stock

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6,014

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Digiode

USA . 2,427 parts In-Stock

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2,427

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Distributors (Availability)

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AZTECH Wire

Italy . 741 parts In-Stock

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$12.221

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741

$12.221

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One Stop Electronics

USA . 1,635 parts In-Stock

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$29.000

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$29.000

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Parana Technologies

USA . 985 parts In-Stock

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$31.607

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$84.054

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985

$31.607

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$84.054

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DigiPath Technology Company

USA . 451 parts In-Stock

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$34.803

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$32.019

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451

$34.803

$32.019

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ChromeModa Solutions

Germany . 5,223 parts In-Stock

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$35.513

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$29.121

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$35.513

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IDEA Electronic Components Group

UK . 117 parts In-Stock

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$35.513

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$33.737

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$31.962

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117

$35.513

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$31.962

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Corphita

USA . 4,453 parts In-Stock

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Microchip USA

USA . 3,519 parts In-Stock

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Kepictronics

USA . 1,488 parts In-Stock

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Overview

Elevate your projects with the LM3S1B21-IBZ80-C5T microcontroller by Texas Instruments. Known for their top-quality manufacturing, Texas Instruments delivers cutting-edge technology that ensures reliability and performance. This microcontroller is versatile and suitable for a wide range of applications, offering customers unmatched value and benefits. With its advanced features and capabilities, this product will take your projects to the next level. Upgrade to Texas Instruments today and experience the difference in quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for flexibility in power requirements and compatibility with various systems.

Package Shape: SQUARE

The square package shape facilitates easier placement and alignment within electronic systems.

Bit Size: 32

A 32-bit architecture provides enhanced processing capabilities and performance for the microcontroller.

Power Supplies (V): 1.2,3.3

Support for a range of power supplies enables compatibility with different voltage requirements in electronic devices.

No. of Terminals: 108

A higher number of terminals allow for more connectivity options, making the microcontroller versatile for various applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and efficient design for mounting the microcontroller on circuit boards.

Minimum Supply Voltage: 3 V

Having a low minimum supply voltage ensures efficient power consumption and operation in low-power systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can withstand harsh thermal conditions and maintain performance.

CPU Family: CORTEX-M3

The CORTEX-M3 CPU family offers advanced processing capabilities and performance features for the microcontroller.

Minimum Operating Temperature: -40 °C

The microcontroller's ability to operate at low temperatures makes it suitable for use in various environmental conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and resistance to corrosion, ensuring reliable connections in the system.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals for data acquisition.

DMA Channels: YES

Direct memory access channels enhance data transfer efficiency and speed for improved performance of the microcontroller.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier routing of connections and integration into circuit board layouts.

ROM Words: 262144

The large ROM size allows for extensive program storage and memory capacity to support complex applications and algorithms.

Maximum Seated Height: 1.5 mm

The low seated height of the microcontroller package minimizes space requirements and enables compact system designs.

Width: 10 mm

A compact width dimension offers space-saving benefits and compatibility with various circuit board layouts.

Maximum Clock Frequency: 16 MHz

A high maximum clock frequency ensures fast processing speeds and performance for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller's ability to withstand peak reflow temperatures for an extended time ensures reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance enables the microcontroller to be soldered onto circuit boards using lead-free processes.

Length: 10 mm

A compact length dimension provides flexibility in system design and integration, especially in space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable performance in harsh environmental conditions and industrial settings.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various peripheral features, it offers comprehensive functionality for diverse applications and system requirements.

RAM Bytes: 98304

The generous amount of RAM storage facilitates efficient data processing and multitasking capabilities for the microcontroller.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and reliable operation for the microcontroller.

Terminal Form: BALL

The ball terminal form offers reliable solder connections and mechanical strength for secure mounting of the microcontroller.

Nominal Supply Voltage: 3.3 V

Having a stable nominal supply voltage ensures consistent performance and operation of the microcontroller in various applications.

PWM Channels: YES

Pulse-width modulation channels enable precise control of output signals, making the microcontroller suitable for motor control and power management.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates and modifications for the microcontroller.

Terminal Pitch: 0.8 mm

The fine terminal pitch provides high-density mounting capability and compatibility with modern SMT assembly processes.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates the microcontroller's resistance to moisture-related issues during manufacturing and storage.

Speed: 80 rpm

The high speed capability of 80 rpm ensures fast data processing and response times for time-sensitive applications.

No. of I/O Lines: 67

A high number of input/output lines provide extensive connectivity options and interface capabilities for the microcontroller.

Technical Specifications

Microcontrollers LM3S1B21-IBZ80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1B21-IBZ80-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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