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LM3S1B21-IBZ80-C5

Texas Instruments

LM3S1B21-IBZ80-C5 by Texas Instruments

LM3S1B21-IBZ80-C5 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing. With features like ADC and DMA channels, it offers versatile functionality in a compact square package ideal for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,311 parts In-Stock

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Digiode

USA . 2,938 parts In-Stock

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2,938

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One Stop Electronics

USA . 1,256 parts In-Stock

1+ parts

$8.000

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$8.000

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Parana Technologies

USA . 751 parts In-Stock

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$13.709

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$14.201

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751

$13.709

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$14.201

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ChromeModa Solutions

Germany . 1,037 parts In-Stock

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$15.403

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$12.630

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1,037

$15.403

$12.630

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IDEA Electronic Components Group

UK . 993 parts In-Stock

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$15.403

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$14.633

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$13.863

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993

$15.403

$14.633

$13.863

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AZTECH Wire

Italy . 688 parts In-Stock

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$17.276

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QUARKTWIN TECHNOLOGY LTD

USA . 23,467 parts In-Stock

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Microchip USA

USA . 4,141 parts In-Stock

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DigiPath Technology Company

USA . 2,348 parts In-Stock

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$13.887

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Corphita

USA . 2,242 parts In-Stock

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Overview

Elevate your projects with the LM3S1B21-IBZ80-C5 microcontroller by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality products like this one, perfect for a wide range of applications. From industrial automation to consumer electronics, this powerful microcontroller offers unmatched performance and reliability. With features like flash ROM programmability, PWM channels, and numerous I/O lines, the LM3S1B21-IBZ80-C5 provides exceptional value and benefits to customers looking for cutting-edge technology. Experience the advantages of Texas Instruments' expertise and innovation with this versatile microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly onto circuit boards, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6V makes this microcontroller energy efficient and less susceptible to power fluctuations.

Package Shape: SQUARE

Square package shape facilitates easier handling and placement on circuit boards, optimizing space and layout design.

Bit Size: 32

32-bit architecture enables the microcontroller to handle complex calculations and processes efficiently, suitable for advanced applications.

Power Supplies (V): 1.2, 3.3

Support for multiple power supplies (1.2V and 3.3V) allows for flexibility in voltage selection based on specific application requirements.

No. of Terminals: 108

Having 108 terminals provides a wide range of input/output options, allowing for connectivity with various external devices and components.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85°C ensures reliable performance even in high-temperature environments.

CPU Family: CORTEX-M3

Utilizing the Cortex-M3 CPU family offers high performance and efficiency in processing data and executing tasks.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C allows for use in cold climates or industrial settings with low temperatures.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to convert analog signals to digital data, essential for interfacing with sensors and measuring external inputs.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency and reduce CPU load, enhancing the overall performance of the microcontroller.

ROM Words: 262144

With 262,144 ROM words available, the microcontroller can store a large program memory, allowing for complex code execution and storage.

Maximum Seated Height: 1.5 mm

Having a maximum seated height of 1.5 mm reduces the overall profile of the microcontroller, making it suitable for compact and slim device designs.

Width: 10 mm

Compact width dimension of 10mm facilitates space-efficient layout on PCBs, enhancing design flexibility and integration possibilities.

Maximum Clock Frequency: 16 MHz

Operating at a maximum clock frequency of 16 MHz allows for fast data processing and execution speed, ideal for real-time applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various built-in peripheral functionalities reduces the need for external components, simplifying the overall system design.

RAM Bytes: 98304

Having 98,304 bytes of RAM provides ample data storage capacity, allowing for efficient data handling and processing during runtime.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and fast operation speeds, making the microcontroller energy efficient and reliable.

PWM Channels: YES

Support for Pulse Width Modulation (PWM) channels enables precise control of analog signals, essential for applications requiring accurate voltage regulation.

ROM Programmability: FLASH

Flash programmability for ROM allows for easy and quick reprogramming of the microcontroller, enabling flexible updates and modifications to the firmware.

Terminal Pitch: 0.8 mm

Having a terminal pitch of 0.8 mm facilitates easy soldering and PCB assembly, ensuring secure and reliable connections.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the microcontroller can withstand moderate exposure to moisture during storage and handling, ensuring long-term reliability.

Speed: 80 rpm

Operating at a speed of 80 revolutions per minute allows for efficient performance in controlling motors or mechanical systems, suitable for motion control applications.

No. of I/O Lines: 67

Having 67 I/O lines provides a sufficient number of input/output options for connecting external devices and peripherals, enhancing system integration capabilities.

Technical Specifications

Microcontrollers LM3S1B21-IBZ80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1B21-IBZ80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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