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LM3S1B21-IBZ80-C3T

Texas Instruments

LM3S1B21-IBZ80-C3T by Texas Instruments

LM3S1B21-IBZ80-C3T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a package style of GRID ARRAY and terminal finish of TIN SILVER COPPER, it offers versatile connectivity options for various electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,225 parts In-Stock

1+ parts

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4,225

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Digiode

USA . 4,193 parts In-Stock

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4,193

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 539 parts In-Stock

1+ parts

$6.000

100+ parts

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539

$6.000

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AZTECH Wire

Italy . 643 parts In-Stock

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$17.735

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643

$17.735

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Parana Technologies

USA . 365 parts In-Stock

1+ parts

$56.021

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365

$56.021

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DigiPath Technology Company

USA . 2,037 parts In-Stock

1+ parts

$61.686

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2,037

$61.686

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ChromeModa Solutions

Germany . 1,579 parts In-Stock

1+ parts

$62.945

100+ parts

$51.615

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1,579

$62.945

$51.615

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IDEA Electronic Components Group

UK . 18 parts In-Stock

1+ parts

$62.945

100+ parts

$59.798

1k+ parts

$56.650

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18

$62.945

$59.798

$56.650

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Corphita

USA . 600 parts In-Stock

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600

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Microchip USA

USA . 238 parts In-Stock

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238

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Overview

Looking for a reliable and high-quality microcontroller for your next project? Look no further than the LM3S1B21-IBZ80-C3T by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers top-notch products that exceed expectations. This microcontroller is perfect for a wide range of applications, offering customers exceptional value and benefits. From its powerful performance to its versatile capabilities, the LM3S1B21-IBZ80-C3T is sure to meet all your needs. Upgrade your project with this top-of-the-line microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the microcontroller, ensuring its longevity and reliability in various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, making the microcontroller versatile for different applications.

Bit Size: 32

The 32-bit architecture enhances processing power and efficiency, enabling the microcontroller to handle complex tasks effectively.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows for flexibility in design and operation, accommodating various power requirements of connected components.

No. of Terminals: 108

Having a high number of terminals provides ample connectivity options for peripherals and external devices, enhancing the microcontroller's capabilities.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Support for DMA channels improves data transfer efficiency and reduces the workload on the CPU, enhancing overall system performance.

ROM Words: 262144

Large ROM capacity allows for storing a significant amount of program data and instructions, accommodating complex software requirements.

RAM Bytes: 98304

Generous RAM capacity provides ample space for temporary data storage and processing, improving the microcontroller's multitasking capabilities.

Technical Specifications

Microcontrollers LM3S1B21-IBZ80-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1B21-IBZ80-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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