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LM3S1969-IQC50-A2

Texas Instruments

LM3S1969-IQC50-A2 by Texas Instruments

Texas Instruments LM3S1969-IQC50-A2 is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at up to 8.192 MHz, it features 52 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,742 parts In-Stock

1+ parts

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6,742

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Digiode

USA . 2,736 parts In-Stock

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2,736

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,624 parts In-Stock

1+ parts

$1.000

100+ parts

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1,624

$1.000

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AZTECH Wire

Italy . 769 parts In-Stock

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$16.228

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769

$16.228

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Parana Technologies

USA . 2,336 parts In-Stock

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$62.183

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2,336

$62.183

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DigiPath Technology Company

USA . 1,774 parts In-Stock

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$68.471

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1,774

$68.471

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ChromeModa Solutions

Germany . 1,964 parts In-Stock

1+ parts

$69.868

100+ parts

$57.292

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1,964

$69.868

$57.292

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IDEA Electronic Components Group

UK . 1,763 parts In-Stock

1+ parts

$69.868

100+ parts

$66.375

1k+ parts

$62.881

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1,763

$69.868

$66.375

$62.881

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Corphita

USA . 3,996 parts In-Stock

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3,996

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Microchip USA

USA . 343 parts In-Stock

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343

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Overview

Experience the next level of innovation with the LM3S1969-IQC50-A2 microcontroller by Texas Instruments. Designed with precision and quality in mind, this powerful device offers endless possibilities for a wide range of applications. Whether you're working on robotics, automation, or IoT projects, this microcontroller delivers unmatched performance and reliability. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations. Elevate your projects with the LM3S1969-IQC50-A2 and unlock a world of opportunities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto PCBs, saving space and enhancing design flexibility.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe and efficient operation of the microcontroller within specified limits.

Package Shape: SQUARE

The square package shape makes it easier to handle and mount the microcontroller onto a PCB, facilitating assembly.

Bit Size: 32

With a 32-bit architecture, the microcontroller offers enhanced processing capabilities, suitable for complex tasks and applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) allows flexibility in power options, catering to different system requirements.

No. of Terminals: 100

The 100 terminals provide ample connectivity options for interfacing with external components and peripherals, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package styles contribute to space-saving and efficient PCB layout, crucial for compact designs.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25 V ensures reliable operation even under low voltage conditions, improving reliability and performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the microcontroller to withstand elevated temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance in cold environments, making it suitable for a wide range of operating conditions.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and connection to the PCB, streamlining the assembly process.

ROM Words: 262144

With a ROM size of 262144 words, the microcontroller offers ample storage capacity for program code and data, suitable for complex applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm allows for a slim profile, beneficial for space-constrained designs and compact electronic devices.

Width: 14 mm

The 14mm width of the microcontroller provides a compact form factor, enabling integration into small-scale electronic products and systems.

Maximum Clock Frequency: 8.192 MHz

The high maximum clock frequency of 8.192 MHz enables fast processing speeds, suitable for real-time applications and high-performance tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature of 260°C ensures proper soldering and reliability during the assembly process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and solder joint integrity during the PCB assembly process.

Length: 14 mm

The 14mm length of the microcontroller contributes to its compact size, making it suitable for small-form-factor designs and space-limited applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture offers efficient processing capabilities, suitable for real-time applications and low-power consumption.

RAM Bytes: 65536

With a RAM size of 65536 bytes, the microcontroller provides ample memory for data storage and manipulation, crucial for efficient operation.

Technology: CMOS

The CMOS technology used in the microcontroller offers low power consumption, high noise immunity, and reliable performance, making it ideal for various applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and mounting onto the PCB, ensuring reliable electrical connections and ease of assembly.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V ensures stable and efficient operation of the microcontroller within specified voltage limits, enhancing reliability.

PWM Channels: YES

The presence of PWM channels allows for precise control of pulse-width modulation signals, essential for applications such as motor control and power management.

ROM Programmability: FLASH

The flash ROM programmability enables easy reprogramming of the microcontroller, essential for updates and modifications in embedded systems and firmware.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch enables fine-pitch soldering and connection to the PCB, contributing to high-density integration and miniaturization.

Moisture Sensitivity Level (MSL): 3

The MSL level 3 indicates the microcontroller's resistance to moisture during handling and storage, ensuring reliability in varied environmental conditions.

Speed: 50 rpm

The speed specification of 50 rpm refers to the rotational speed of any integrated motor control, indicating the microcontroller's capability to drive and control motor applications.

No. of I/O Lines: 52

The 52 I/O lines provide ample input and output options for interfacing with external devices and peripherals, enhancing the microcontroller's versatility and connectivity.

Technical Specifications

Microcontrollers LM3S1969-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1969-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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