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LM3S1968-IBZ50-A2T

Texas Instruments

LM3S1968-IBZ50-A2T by Texas Instruments

Texas Instruments LM3S1968-IBZ50-A2T microcontroller features 32-bit CPU, 108 terminals, and 65536 bytes of RAM. Ideal for industrial applications with peripherals like PWM(6), QEI(2), TIMER(4), WDT, and connectivity options such as I2C, SSI(2), UART(3). Operating temperature range from -40 to 85°C makes it suitable for various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,238 parts In-Stock

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3,238

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Digiode

USA . 445 parts In-Stock

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445

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Distributors (Availability)

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Andel Nordic

Denmark . 3,048 parts In-Stock

1+ parts

$1.581

100+ parts

-

1k+ parts

$1.518

10k+ parts

$1.518

3,048

$1.581

-

$1.518

$1.518

One Stop Electronics

USA . 544 parts In-Stock

1+ parts

$3.000

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-

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544

$3.000

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AZTECH Wire

Italy . 347 parts In-Stock

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$19.507

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347

$19.507

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Parana Technologies

USA . 1,607 parts In-Stock

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$24.372

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$25.044

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1,607

$24.372

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$25.044

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IDEA Electronic Components Group

UK . 620 parts In-Stock

1+ parts

$27.384

100+ parts

$26.015

1k+ parts

$24.646

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620

$27.384

$26.015

$24.646

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ChromeModa Solutions

Germany . 121 parts In-Stock

1+ parts

$27.384

100+ parts

$22.455

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121

$27.384

$22.455

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Corphita

USA . 1,214 parts In-Stock

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DigiPath Technology Company

USA . 693 parts In-Stock

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$24.689

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$24.689

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Microchip USA

USA . 439 parts In-Stock

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Overview

Discover the LM3S1968-IBZ50-A2T by Texas Instruments, a high-quality microcontroller offering unparalleled performance and reliability. Designed by a trusted manufacturer in the industry, this product is perfect for a wide range of applications. From industrial automation to consumer electronics, this microcontroller provides value, benefits, and advantages that cater to the unique needs of every customer. Experience superior functionality and efficiency with the LM3S1968-IBZ50-A2T, your ultimate solution for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller.

Integrated Cache: YES

Improves processing speed and efficiency.

Surface Mount: YES

Enables easy integration onto circuit boards.

Maximum Supply Voltage: 2.75 V

Offers a safe operating range for the microcontroller.

On Chip Data RAM Width: 8

Allows for efficient data processing and storage.

Package Shape: SQUARE

Facilitates easy placement and soldering during assembly.

Bit Size: 32

Provides high computational capabilities.

Power Supplies (V): 2.5,3.3

Offers flexibility in power input options.

No. of Terminals: 108

Provides a wide range of connectivity options.

Package Style (Meter): GRID ARRAY

Facilitates easy mounting and soldering on PCBs.

Minimum Supply Voltage: 2.25 V

Ensures stable operation under varying voltage conditions.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with high temperature requirements.

CPU Family: CORTEX-M3

Part of a reliable and widely used processor family.

Minimum Operating Temperature: -40 °C

Suitable for operation in harsh environmental conditions.

Terminal Finish: TIN SILVER COPPER

Ensures long-term reliability and corrosion resistance.

ADC Channels: YES

Enables analog to digital conversion for sensor integration.

Terminal Position: BOTTOM

Facilitates easy soldering and connection to PCBs.

ROM Words: 262144

Ample memory for storing program instructions and data.

Maximum Seated Height: 1.5 mm

Compact design for space-constrained applications.

Width: 10 mm

Compact form factor for easy integration into designs.

Boundary Scan: YES

Facilitates testing and debugging during production.

Peripherals: PWM(6), QEI(2), TIMER(4), WDT

Offers a wide range of peripheral options for diverse applications.

Maximum Clock Frequency: 0.032 MHz

Provides high-speed processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

Suits high-temperature reflow processes for soldering.

Length: 10 mm

Compact design for space-constrained applications.

Temperature Grade: INDUSTRIAL

Suitable for rugged industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses efficient RISC architecture for optimized performance.

No. of Timers: 4

Facilitates time-sensitive operations and scheduling.

RAM Bytes: 65536

Large memory for data storage and manipulation.

Technology: CMOS

Low power consumption and reliable operation.

Terminal Form: BALL

Facilitates easy soldering and connection to PCBs.

Analog To Digital Convertors: 8-Ch 10-Bit

Enables multiple analog sensor inputs with high resolution.

Nominal Supply Voltage: 2.5 V

Optimal voltage for stable performance.

No. of Serial I/Os: 6

Facilitates communication with external devices.

PWM Channels: YES

Enables pulse width modulation for precise control.

Connectivity: I2C, SSI(2), UART(3)

Supports multiple communication protocols for versatile connectivity.

ROM Programmability: FLASH

Allows for easy reprogramming of memory.

Terminal Pitch: 0.8 mm

Ideal for compact PCB layout and design.

Format: FIXED POINT

Precise numerical calculations for accurate operations.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with moderate moisture exposure.

Speed: 50 rpm

Ideal for applications with rotational speed control requirements.

Low Power Mode: YES

Enables power-saving options for energy-efficient operation.

On Chip Program ROM Width: 8

Efficient storage of program instructions.

No. of I/O Lines: 52

Ample input and output options for connectivity.

Technical Specifications

Microcontrollers LM3S1968-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

52

No. of Serial I/Os:

6

No. of Terminals:

108

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI(2), UART(3)

Peripherals:

PWM(6), QEI(2), TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S1968-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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