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LM3S1968-EQC50-A2T

Texas Instruments

LM3S1968-EQC50-A2T by Texas Instruments

Texas Instruments LM3S1968-EQC50-A2T is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at up to 0.032 MHz, it offers 52 I/O lines and PWM channels for industrial applications requiring high-speed processing in a compact FLATPACK package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,102 parts In-Stock

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Digiode

USA . 3,244 parts In-Stock

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3,244

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Distributors (Availability)

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AZTECH Wire

Italy . 733 parts In-Stock

1+ parts

$8.193

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733

$8.193

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One Stop Electronics

USA . 147 parts In-Stock

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$31.000

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147

$31.000

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Parana Technologies

USA . 546 parts In-Stock

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$51.657

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546

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DigiPath Technology Company

USA . 739 parts In-Stock

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$56.881

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739

$56.881

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ChromeModa Solutions

Germany . 3,982 parts In-Stock

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$58.042

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$47.594

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3,982

$58.042

$47.594

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IDEA Electronic Components Group

UK . 1,590 parts In-Stock

1+ parts

$58.042

100+ parts

$55.140

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$52.238

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1,590

$58.042

$55.140

$52.238

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Corphita

USA . 2,122 parts In-Stock

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Microchip USA

USA . 287 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the LM3S1968-EQC50-A2T microcontroller. This innovative product boasts cutting-edge technology and a wide range of applications in various industries. From industrial automation to consumer electronics, this microcontroller offers exceptional value, performance, and flexibility. Trust Texas Instruments to deliver superior products that meet your needs and exceed your expectations. Upgrade your projects with the LM3S1968-EQC50-A2T microcontroller today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for easy handling and protection of the internal components.

Surface Mount: YES

Allows for easy and efficient soldering onto PCBs, saving time and effort in the assembly process.

Maximum Supply Voltage: 2.75 V

Operates within safe voltage limits, ensuring reliability and longevity of the microcontroller.

Package Shape: SQUARE

Optimal shape for space-efficient PCB layout and placement.

Bit Size: 32

High bit size allows for complex calculations and operations, suitable for a wide range of applications.

Power Supplies (V): 2.5,3.3

Compatible with common power supply voltages, making integration into existing systems easy.

No. of Terminals: 100

Sufficient number of terminals for connecting to external devices and components.

Package Style (Meter): FLATPACK

Flatpack design offers good heat dissipation and ease of mounting on PCBs.

Minimum Supply Voltage: 2.25 V

Allows for operation at lower power levels, ideal for energy-efficient applications.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Operates in extremely low temperatures, suitable for a wide range of environmental conditions.

ADC Channels: YES

Integrated ADC channels for analog signal processing, expanding the capabilities of the microcontroller.

Terminal Position: QUAD

Quad terminal position allows for easy connectivity and efficient routing of signals.

ROM Words: 262144

Large ROM capacity for storing program instructions and data, suitable for complex applications.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Width: 14 mm

Compact width for easy placement on PCBs and efficient use of space.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast and efficient operation of the microcontroller.

Length: 14 mm

Compact length for space-efficient PCB layout and placement.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliability in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and optimized performance in embedded applications.

RAM Bytes: 65536

Sufficient RAM capacity for data storage and processing, suitable for multitasking applications.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and reliable electrical connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance of the microcontroller.

PWM Channels: YES

Integrated PWM channels for precise control of analog signals, suitable for motor control and power management.

ROM Programmability: FLASH

Flash programmable ROM for easy updates and modifications of program code.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact PCB design and efficient signal routing.

Speed: 50 rpm

High speed performance for real-time processing and control applications.

No. of I/O Lines: 52

Sufficient number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1968-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

52

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1968-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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