Loading...

LM3S1960-IQC50-A2T

Texas Instruments

LM3S1960-IQC50-A2T by Texas Instruments

LM3S1960-IQC50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a temperature range from -40 to 85 °C, it offers reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,539 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,539

-

-

-

-

Digiode

USA . 393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

393

-

-

-

-

Chip Stock

USA . 131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

131

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 861 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

-

10k+ parts

-

861

$3.000

-

-

-

AZTECH Wire

Italy . 251 parts In-Stock

1+ parts

$8.774

100+ parts

-

1k+ parts

-

10k+ parts

-

251

$8.774

-

-

-

Parana Technologies

USA . 1,102 parts In-Stock

1+ parts

$15.905

100+ parts

-

1k+ parts

$16.259

10k+ parts

-

1,102

$15.905

-

$16.259

-

ChromeModa Solutions

Germany . 2,276 parts In-Stock

1+ parts

$17.871

100+ parts

$14.654

1k+ parts

-

10k+ parts

-

2,276

$17.871

$14.654

-

-

IDEA Electronic Components Group

UK . 868 parts In-Stock

1+ parts

$17.871

100+ parts

$16.977

1k+ parts

$16.084

10k+ parts

-

868

$17.871

$16.977

$16.084

-

Microchip USA

USA . 2,056 parts In-Stock

1+ parts

$39.520

100+ parts

$38.950

1k+ parts

$38.670

10k+ parts

$38.390

2,056

$39.520

$38.950

$38.670

$38.390

Corphita

USA . 3,586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,586

-

-

-

-

DigiPath Technology Company

USA . 201 parts In-Stock

1+ parts

-

100+ parts

$16.112

1k+ parts

-

10k+ parts

-

201

-

$16.112

-

-

Overview

Unleash the power of cutting-edge technology with the LM3S1960-IQC50-A2T microcontroller by Texas Instruments. Crafted with precision and expertise, this high-quality device offers unparalleled performance and reliability in a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers exceptional value, efficiency, and flexibility. Trust Texas Instruments to provide you with the tools you need to bring your innovative ideas to life. Elevate your projects to new heights with the LM3S1960-IQC50-A2T microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount design allows for easy mounting on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a maximum supply voltage of 2.75 V.

Package Shape: SQUARE

Square package shape provides a compact form factor for space-constrained applications.

Bit Size: 32

32-bit architecture offers enhanced processing power and performance capabilities.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options for flexibility in voltage requirements.

No. of Terminals: 100

100 terminals provide ample connectivity options for various peripherals and external devices.

Package Style (Meter): FLATPACK

Flatpack package style ensures easy handling and installation during assembly.

Minimum Supply Voltage: 2.25 V

Operates reliably with a minimum supply voltage of 2.25 V.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows for operation in industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable performance in extreme cold conditions.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Includes ADC channels for analog signal processing and conversion capabilities.

Terminal Position: QUAD

Quad terminal position allows for easy connections and efficient PCB layout.

ROM Words: 262144

Large ROM capacity of 262144 words for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6 mm for slim and compact designs.

Width: 14 mm

Compact width of 14 mm for space-efficient PCB layouts.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032 MHz for fast and efficient processing.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for up to 30 seconds, ensuring reliable soldering.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C for high-temperature soldering processes.

Length: 14 mm

Compact length of 14 mm for space-saving designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade for reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture for efficient processing and reduced power consumption.

RAM Bytes: 65536

Large RAM capacity of 65536 bytes for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and reliable connections.

Nominal Supply Voltage: 2.5 V

Nominal supply voltage of 2.5 V for stable and efficient operation.

PWM Channels: YES

Includes PWM channels for precise control of pulse width modulation signals.

ROM Programmability: FLASH

Flash ROM programmability for easy and fast reprogramming of data and instructions.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5 mm for high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture during storage and handling.

Speed: 50 rpm

Operating speed of 50 RPM for efficient performance in various applications.

No. of I/O Lines: 60

60 I/O lines for versatile input/output connections and peripheral interfacing.

Technical Specifications

Microcontrollers LM3S1960-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1960-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20