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LM3S1960-IBZ50-A2

Texas Instruments

LM3S1960-IBZ50-A2 by Texas Instruments

LM3S1960-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a package style of GRID ARRAY and terminal finish of TIN SILVER COPPER, it offers versatile connectivity options in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,542 parts In-Stock

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Digiode

USA . 68 parts In-Stock

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68

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Distributors (Availability)

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AZTECH Wire

Italy . 428 parts In-Stock

1+ parts

$10.445

100+ parts

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428

$10.445

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One Stop Electronics

USA . 1,339 parts In-Stock

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$27.000

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1,339

$27.000

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Microchip USA

USA . 1,198 parts In-Stock

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$45.050

100+ parts

$44.410

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$44.080

10k+ parts

$43.760

1,198

$45.050

$44.410

$44.080

$43.760

Parana Technologies

USA . 451 parts In-Stock

1+ parts

$55.541

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451

$55.541

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DigiPath Technology Company

USA . 528 parts In-Stock

1+ parts

$61.158

100+ parts

$56.265

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528

$61.158

$56.265

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ChromeModa Solutions

Germany . 4,634 parts In-Stock

1+ parts

$62.406

100+ parts

$51.173

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4,634

$62.406

$51.173

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IDEA Electronic Components Group

UK . 627 parts In-Stock

1+ parts

$62.406

100+ parts

$59.286

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$56.165

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627

$62.406

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$56.165

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Corphita

USA . 3,938 parts In-Stock

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3,938

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Overview

Elevate your projects with the LM3S1960-IBZ50-A2 microcontroller by Texas Instruments. Crafted with precision and innovation, this powerful device offers seamless integration, exceptional performance, and versatility for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers unmatched reliability and efficiency. Unlock endless possibilities and unleash your creativity with the LM3S1960-IBZ50-A2. Elevate your projects with the LM3S1960-IBZ50-A2 microcontroller by Texas Instruments. Crafted with precision and innovation, this powerful device offers seamless integration, exceptional performance, and versatility for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers unmatched reliability and efficiency. Unlock endless possibilities and unleash your creativity with the LM3S1960-IBZ50-A2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation and prevents damage to the microcontroller from overvoltage conditions.

Package Shape: SQUARE

The square package shape provides uniformity and ease of mounting, allowing for efficient PCB layout design.

Bit Size: 32

The 32-bit architecture allows for high processing capabilities, making the microcontroller suitable for complex tasks and applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) offers flexibility in system design and compatibility with different power sources.

No. of Terminals: 108

The high number of terminals provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style allows for a compact and space-efficient footprint, ideal for applications with limited space constraints.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25V ensures reliable operation of the microcontroller even under low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C makes the microcontroller suitable for industrial applications where elevated temperatures may be encountered.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in cold environments, expanding the range of possible applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of TIN SILVER COPPER provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors and signals, expanding its capabilities for a wider range of applications.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting on the PCB, ensuring reliable connections and stability during operation.

ROM Words: 262144

The large ROM capacity of 262144 words enables storing of program code and data, making the microcontroller suitable for applications requiring extensive memory.

Maximum Seated Height: 1.5 mm

The low seated height of 1.5mm allows for slim and compact designs, ideal for applications with space constraints.

Width: 10 mm

The width of 10mm provides a compact form factor, contributing to space-efficient PCB layout and system integration.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 32 MHz enables fast and efficient operation, making the microcontroller suitable for applications requiring high-speed processing.

Speed: 50 rpm

The speed rating of 50rpm indicates the performance capability of the microcontroller, enabling quick response times and efficient execution of tasks.

No. of I/O Lines: 60

The high number of I/O lines (60) provides ample connectivity options for interfacing with external devices and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers LM3S1960-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1960-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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