Loading...

LM3S1960-EQC50-A2T

Texas Instruments

LM3S1960-EQC50-A2T by Texas Instruments

Texas Instruments LM3S1960-EQC50-A2T microcontroller features 32-bit architecture, 262144 ROM words, and 65536 RAM bytes. With a clock frequency of 0.032 MHz, it is ideal for industrial applications requiring ADC channels, PWM channels, and 60 I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,166

-

-

-

-

Digiode

USA . 1,307 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,307

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 519 parts In-Stock

1+ parts

$11.163

100+ parts

-

1k+ parts

-

10k+ parts

-

519

$11.163

-

-

-

One Stop Electronics

USA . 1,109 parts In-Stock

1+ parts

$32.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,109

$32.000

-

-

-

Parana Technologies

USA . 395 parts In-Stock

1+ parts

$44.031

100+ parts

-

1k+ parts

-

10k+ parts

-

395

$44.031

-

-

-

DigiPath Technology Company

USA . 1,554 parts In-Stock

1+ parts

$48.484

100+ parts

$44.605

1k+ parts

-

10k+ parts

-

1,554

$48.484

$44.605

-

-

ChromeModa Solutions

Germany . 4,407 parts In-Stock

1+ parts

$49.473

100+ parts

$40.568

1k+ parts

-

10k+ parts

-

4,407

$49.473

$40.568

-

-

IDEA Electronic Components Group

UK . 1,468 parts In-Stock

1+ parts

$49.473

100+ parts

$46.999

1k+ parts

$44.526

10k+ parts

-

1,468

$49.473

$46.999

$44.526

-

Corphita

USA . 893 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

893

-

-

-

-

Microchip USA

USA . 242 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

242

-

-

-

-

Overview

Experience the power of innovation with the LM3S1960-EQC50-A2T microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This versatile microcontroller is perfect for a wide range of applications, offering customers unmatched value and efficiency. With advanced features and cutting-edge technology, this product provides countless benefits and advantages to help you stay ahead in today's fast-paced world. Trust Texas Instruments to deliver excellence in every detail.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 2.75 V

The low maximum supply voltage helps in reducing power consumption and extends battery life in mobile devices.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex calculations and operations efficiently.

Power Supplies (V): 2.5, 3.3

Support for multiple power supply voltages provides flexibility in system design and compatibility with different peripherals.

No. of Terminals: 100

Having a large number of terminals allows for connecting various external components and peripherals to the microcontroller.

Package Style (Meter): FLATPACK

The flatpack design offers a low profile and compact form factor, making it suitable for space-constrained applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this microcontroller suitable for industrial environments with harsh conditions.

ADC Channels: YES

Built-in ADC channels enable analog signal processing, making the microcontroller versatile for a wide range of applications.

ROM Words: 262144

The large ROM capacity allows for storing a significant amount of program data, enabling complex firmware and applications to be run.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it offers high performance and efficient operation, well-suited for real-time processing tasks.

RAM Bytes: 65536

With a sizeable RAM capacity, the microcontroller can efficiently store and access data during operation, enhancing overall performance.

ROM Programmability: FLASH

The flash programmable ROM allows for easy and quick updates to the firmware without needing specialized equipment or processes.

Technical Specifications

Microcontrollers LM3S1960-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1960-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20