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LM3S1960-EQC50-A2

Texas Instruments

LM3S1960-EQC50-A2 by Texas Instruments

LM3S1960-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it features 60 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,871 parts In-Stock

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2,871

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Digiode

USA . 2,027 parts In-Stock

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2,027

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Distributors (Availability)

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AZTECH Wire

Italy . 717 parts In-Stock

1+ parts

$8.313

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717

$8.313

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One Stop Electronics

USA . 583 parts In-Stock

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$12.000

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583

$12.000

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Parana Technologies

USA . 709 parts In-Stock

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$21.396

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$21.742

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709

$21.396

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$21.742

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ChromeModa Solutions

Germany . 3,018 parts In-Stock

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$24.040

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$19.713

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3,018

$24.040

$19.713

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IDEA Electronic Components Group

UK . 701 parts In-Stock

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$24.040

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$22.838

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$21.636

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701

$24.040

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$21.636

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Corphita

USA . 1,663 parts In-Stock

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1,663

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DigiPath Technology Company

USA . 1,133 parts In-Stock

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$21.674

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Microchip USA

USA . 126 parts In-Stock

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Overview

Experience the cutting-edge technology of the LM3S1960-EQC50-A2 microcontroller by Texas Instruments. With a powerful 32-bit architecture and a wide range of applications, this device is designed to meet the needs of industrial users looking for reliability and performance. From its high-quality plastic/epoxy construction to its advanced features like ADC channels and PWM capabilities, this microcontroller offers exceptional value and efficiency. Trust in Texas Instruments' reputation for excellence and elevate your projects with the LM3S1960-EQC50-A2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for portable and rugged applications.

Surface Mount: YES

Easier installation and more space-efficient on PCBs.

Maximum Supply Voltage: 2.75 V

Allows for a stable and safe power supply within the specified range.

Package Shape: SQUARE

Simplifies the PCB layout and saves space in the design.

Bit Size: 32

Allows for handling larger data sizes and more complex operations.

Power Supplies (V): 2.5, 3.3

Supports multiple voltage options for compatibility with various systems.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK

Offers a low-profile design for space-constrained applications.

Minimum Supply Voltage: 2.25 V

Ensures reliable operation even under low voltage conditions.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with high temperature fluctuations.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without performance degradation.

ADC Channels: YES

Allows for analog to digital conversion for sensor interfacing and input processing.

Terminal Position: QUAD

Facilitates easy and secure connection with other devices or peripherals.

ROM Words: 262144

Large memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact product form factor.

Width: 14 mm

Compact size for efficient use of space on the PCB.

Maximum Clock Frequency: 0.032 MHz

Provides high processing speed for quick response times.

Length: 14 mm

Balanced dimensions for a square package shape, optimizing space utilization.

Temperature Grade: INDUSTRIAL

Capable of withstanding harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses a RISC architecture for efficient execution of instructions.

RAM Bytes: 65536

Sufficient random access memory for data storage and manipulation.

Technology: CMOS

Low power consumption and high noise immunity characteristics.

Terminal Form: GULL WING

Secure and reliable terminal connections on the PCB.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent performance.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of output signals.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming and firmware updates.

Terminal Pitch: 0.5 mm

Fine pitch for compact integration and high terminal density on the PCB.

Speed: 50 rpm

Moderate processing speed suitable for various applications.

No. of I/O Lines: 60

Plenty of Input/Output lines for versatile connectivity options.

Technical Specifications

Microcontrollers LM3S1960-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1960-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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