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LM3S1958-IQC50-A2

Texas Instruments

LM3S1958-IQC50-A2 by Texas Instruments

Texas Instruments LM3S1958-IQC50-A2 is a 32-bit microcontroller with Cortex-M3 CPU family, 262144 ROM words, and 65536 RAM bytes. It features 8 ADC channels, 4 PWM channels, and connectivity options like I2C(2), SSI(2), UART(3). Ideal for industrial applications requiring high-speed processing at up to 50 MHz clock frequency.

Median Price

$24.140

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 220 parts In-Stock

1+ parts

-

100+ parts

$20.890

1k+ parts

$18.690

10k+ parts

$17.590

220

-

$20.890

$18.690

$17.590

DigiKey

USA . 220 parts In-Stock

1+ parts

-

100+ parts

$24.140

1k+ parts

-

10k+ parts

-

220

-

$24.140

-

-

Verical

USA . 220 parts In-Stock

1+ parts

-

100+ parts

$26.113

1k+ parts

$23.363

10k+ parts

$21.988

220

-

$26.113

$23.363

$21.988

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,425 parts In-Stock

1+ parts

$22.050

100+ parts

-

1k+ parts

-

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2,425

$22.050

-

-

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Vyrian

USA . 2,791 parts In-Stock

1+ parts

-

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-

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2,791

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-

-

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DigiKey Marketplace

USA . 220 parts In-Stock

1+ parts

-

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-

1k+ parts

-

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-

220

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,547 parts In-Stock

1+ parts

$20.889

100+ parts

-

1k+ parts

-

10k+ parts

-

2,547

$20.889

-

-

-

Microchip USA

USA . 2,054 parts In-Stock

1+ parts

$61.340

100+ parts

$60.270

1k+ parts

$59.740

10k+ parts

$59.210

2,054

$61.340

$60.270

$59.740

$59.210

Parana Technologies

USA . 1,653 parts In-Stock

1+ parts

$62.530

100+ parts

$5,806.824

1k+ parts

$56.277

10k+ parts

-

1,653

$62.530

$5,806.824

$56.277

-

DigiPath Technology Company

USA . 1,465 parts In-Stock

1+ parts

$68.853

100+ parts

$63.345

1k+ parts

-

10k+ parts

-

1,465

$68.853

$63.345

-

-

ChromeModa Solutions

Germany . 429 parts In-Stock

1+ parts

$70.258

100+ parts

$57.612

1k+ parts

-

10k+ parts

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429

$70.258

$57.612

-

-

IDEA Electronic Components Group

UK . 67 parts In-Stock

1+ parts

$70.258

100+ parts

$66.745

1k+ parts

$63.232

10k+ parts

-

67

$70.258

$66.745

$63.232

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Authorized Procurement Solutions

USA . 36,000 parts In-Stock

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36,000

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Kepictronics

USA . 3,579 parts In-Stock

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3,579

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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1,000

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Futuretech Components

Singapore . 886 parts In-Stock

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886

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Overview

Experience the cutting-edge technology of Texas Instruments with the LM3S1958-IQC50-A2 microcontroller. This high-quality product offers integrated cache, low power mode, and a wide range of connectivity options, making it perfect for a variety of applications. From industrial automation to consumer electronics, this versatile device provides unbeatable value and performance. Trust in Texas Instruments for top-of-the-line microcontrollers that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the package, making it suitable for various applications.

Integrated Cache: YES

Integrated cache helps in improving the overall performance and efficiency of the microcontroller by reducing access time to frequently used instructions or data.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows flexibility in power supply options and supports a wide range of applications requiring higher voltage operation.

Surface Mount: YES

Surface mount feature simplifies the installation process and saves space on the PCB, making it ideal for compact and space-constrained designs.

On Chip Data RAM Width: 8

8-bit data RAM width provides a good balance between performance and efficiency for processing and storing data on the microcontroller.

Bit Size: 32

32-bit processing capability allows for handling larger data sets and performing complex calculations, making it suitable for demanding applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages enables compatibility with various power sources and allows for power optimization in different operating conditions.

No. of Terminals: 100

Having a high number of terminals provides flexibility in interfacing with external components, peripherals, and communication interfaces for versatile connectivity options.

ADC Channels: YES

Built-in analog-to-digital converter channels enable the microcontroller to interface with analog sensors and acquire real-world data for processing and control applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Designed as a microcontroller with RISC architecture ensures efficient and fast execution of instructions, improving overall system performance in embedded applications.

Technical Specifications

Microcontrollers LM3S1958-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

52

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SSI(2), UART(3)

Peripherals:

TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S1958-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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