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LM3S1958-IBZ50-A2T

Texas Instruments

LM3S1958-IBZ50-A2T by Texas Instruments

LM3S1958-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring up to 52 I/O lines and PWM channels. With a package style of GRID ARRAY and terminal finish of TIN SILVER COPPER, it offers versatile performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,893 parts In-Stock

1+ parts

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3,893

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Digiode

USA . 2,660 parts In-Stock

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2,660

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 572 parts In-Stock

1+ parts

$13.368

100+ parts

-

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572

$13.368

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Parana Technologies

USA . 181 parts In-Stock

1+ parts

$17.939

100+ parts

-

1k+ parts

$18.106

10k+ parts

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181

$17.939

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$18.106

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ChromeModa Solutions

Germany . 3,516 parts In-Stock

1+ parts

$20.156

100+ parts

$16.528

1k+ parts

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3,516

$20.156

$16.528

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IDEA Electronic Components Group

UK . 713 parts In-Stock

1+ parts

$20.156

100+ parts

$19.148

1k+ parts

$18.140

10k+ parts

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713

$20.156

$19.148

$18.140

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One Stop Electronics

USA . 621 parts In-Stock

1+ parts

$24.000

100+ parts

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621

$24.000

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Microchip USA

USA . 2,038 parts In-Stock

1+ parts

$42.870

100+ parts

$42.260

1k+ parts

$41.950

10k+ parts

$41.650

2,038

$42.870

$42.260

$41.950

$41.650

DigiPath Technology Company

USA . 1,438 parts In-Stock

1+ parts

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$18.173

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1,438

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$18.173

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Corphita

USA . 515 parts In-Stock

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515

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Overview

Unlock endless possibilities with the LM3S1958-IBZ50-A2T by Texas Instruments, a high-quality microcontroller designed to elevate your projects to new heights. With Texas Instruments' reputation for excellence in manufacturing, this device offers unparalleled reliability and performance. Ideal for a wide range of applications, this microcontroller provides value and benefits that will exceed your expectations. Experience innovation like never before with the LM3S1958-IBZ50-A2T and see your ideas come to life effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Easy to mount on a PCB, reducing assembly time and cost.

Maximum Supply Voltage: 2.75 V

Efficient power consumption and compatibility with lower voltage systems.

Bit Size: 32

High processing capabilities for complex tasks and calculations.

Power Supplies (V): 2.5,3.3

Flexible power options to suit different voltage requirements.

No. of Terminals: 108

Sufficient connectivity options for various peripherals and components.

Package Style (Meter): GRID ARRAY

Compact design for space-efficient PCB layouts.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature conditions.

Minimum Operating Temperature: -40 °C

Operational in extreme cold environments without performance issues.

ADC Channels: YES

Analog-to-digital conversion capability for interfacing with analog sensors.

ROM Words: 262144

Large memory capacity for storing program instructions and data.

Maximum Seated Height: 1.5 mm

Low profile design for compact and slim device form factors.

Width: 10 mm

Narrow form factor for space-saving applications.

Maximum Clock Frequency: 0.032 MHz

High-speed processing for real-time applications and responsiveness.

Technology: CMOS

Efficient and low-power consumption technology for extended battery life.

Nominal Supply Voltage: 2.5 V

Stable and reliable voltage supply for consistent performance.

ROM Programmability: FLASH

Reprogrammable memory for easy updates and modifications to firmware.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture damage, suitable for varying environmental conditions.

No. of I/O Lines: 52

Sufficient input/output options for versatile connectivity and expansion.

Technical Specifications

Microcontrollers LM3S1958-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1958-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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