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LM3S1958-IBZ50-A2

Texas Instruments

LM3S1958-IBZ50-A2 by Texas Instruments

LM3S1958-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, making it suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a package style of GRID ARRAY and terminal finish of TIN SILVER COPPER, this microcontroller offers versatile connectivity options for various electronic systems.

Median Price

$11.630

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$11.630

1k+ parts

$10.400

10k+ parts

$9.790

90

-

$11.630

$10.400

$9.790

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,309 parts In-Stock

1+ parts

$12.264

100+ parts

-

1k+ parts

-

10k+ parts

-

3,309

$12.264

-

-

-

Vyrian

USA . 4,674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,674

-

-

-

-

DigiKey Marketplace

USA . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,661 parts In-Stock

1+ parts

$11.619

100+ parts

-

1k+ parts

-

10k+ parts

-

1,661

$11.619

-

-

-

AZTECH Wire

Italy . 291 parts In-Stock

1+ parts

$20.380

100+ parts

-

1k+ parts

-

10k+ parts

-

291

$20.380

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$36.202

100+ parts

$32.944

1k+ parts

$29.686

10k+ parts

-

3,000

$36.202

$32.944

$29.686

-

Parana Technologies

USA . 768 parts In-Stock

1+ parts

$41.899

100+ parts

-

1k+ parts

-

10k+ parts

-

768

$41.899

-

-

-

DigiPath Technology Company

USA . 441 parts In-Stock

1+ parts

$46.135

100+ parts

$42.445

1k+ parts

-

10k+ parts

-

441

$46.135

$42.445

-

-

ChromeModa Solutions

Germany . 5,415 parts In-Stock

1+ parts

$47.077

100+ parts

$38.603

1k+ parts

-

10k+ parts

-

5,415

$47.077

$38.603

-

-

IDEA Electronic Components Group

UK . 2,181 parts In-Stock

1+ parts

$47.077

100+ parts

$44.723

1k+ parts

$42.369

10k+ parts

-

2,181

$47.077

$44.723

$42.369

-

Microchip USA

USA . 358 parts In-Stock

1+ parts

$48.880

100+ parts

$48.180

1k+ parts

$47.830

10k+ parts

$47.480

358

$48.880

$48.180

$47.830

$47.480

Overview

Discover the LM3S1958-IBZ50-A2 by Texas Instruments, a high-quality microcontroller that brings innovation and reliability to your projects. With Texas Instruments' renowned reputation for excellence, this microcontroller offers endless possibilities in applications such as industrial automation, robotics, and consumer electronics. Providing value, efficiency, and performance, the LM3S1958-IBZ50-A2 is the perfect choice for those seeking cutting-edge technology with ease of use and exceptional results. Elevate your designs with this versatile microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a maximum supply voltage of 2.75V, making it suitable for low power applications.

Package Shape: SQUARE

Square shape allows for compact integration into electronic devices.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities and performance.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options for flexibility in design and implementation.

No. of Terminals: 108

Provides sufficient terminals for connectivity to external components and peripherals.

Package Style (Meter): GRID ARRAY

Grid array package style offers enhanced electrical performance and thermal dissipation.

Minimum Supply Voltage: 2.25 V

Can operate efficiently at a low minimum supply voltage of 2.25V.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ideal for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, suitable for outdoor and harsh environments.

Terminal Finish: TIN SILVER COPPER

Terminal finish provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Integrated ADC channels enable analog signal processing for sensor interfacing.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB layout and thermal management.

ROM Words: 262144

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.5 mm

Low seated height for space-constrained applications.

Width: 10 mm

Compact width for easy integration into electronic designs.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast and efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for efficient manufacturing processes.

Peak Reflow Temperature °C: 260

Can endure high reflow temperatures for soldering without damage.

Length: 10 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture provides efficient processing and reduced power consumption.

RAM Bytes: 65536

Generous RAM capacity for data storage and manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for reliable solder connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent operation.

PWM Channels: YES

Integrated PWM channels for precise control of connected devices.

ROM Programmability: FLASH

Flash ROM programmability for easy firmware updates and reprogramming.

Terminal Pitch: 0.8 mm

Fine terminal pitch for compact PCB layout and high-density integration.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the level of protection against moisture exposure during storage and handling.

Speed: 50 rpm

Operates at a speed of 50 RPM, suitable for various control applications.

No. of I/O Lines: 52

Ample I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1958-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1958-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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