Loading...

LM3S1937-IBZ50-A2T

Texas Instruments

LM3S1937-IBZ50-A2T by Texas Instruments

LM3S1937-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a package style of GRID ARRAY and terminal finish of TIN SILVER COPPER, it offers versatile connectivity options in compact dimensions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,537 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,537

-

-

-

-

Digiode

USA . 1,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,900

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 729 parts In-Stock

1+ parts

$6.172

100+ parts

-

1k+ parts

-

10k+ parts

-

729

$6.172

-

-

-

One Stop Electronics

USA . 693 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

-

693

$10.000

-

-

-

Parana Technologies

USA . 811 parts In-Stock

1+ parts

$31.682

100+ parts

-

1k+ parts

$86.719

10k+ parts

-

811

$31.682

-

$86.719

-

DigiPath Technology Company

USA . 946 parts In-Stock

1+ parts

$34.886

100+ parts

-

1k+ parts

-

10k+ parts

-

946

$34.886

-

-

-

ChromeModa Solutions

Germany . 5,762 parts In-Stock

1+ parts

$35.598

100+ parts

$29.190

1k+ parts

-

10k+ parts

-

5,762

$35.598

$29.190

-

-

IDEA Electronic Components Group

UK . 664 parts In-Stock

1+ parts

$35.598

100+ parts

$33.818

1k+ parts

$32.038

10k+ parts

-

664

$35.598

$33.818

$32.038

-

Microchip USA

USA . 2,712 parts In-Stock

1+ parts

$41.900

100+ parts

$41.310

1k+ parts

$41.010

10k+ parts

$40.710

2,712

$41.900

$41.310

$41.010

$40.710

Corphita

USA . 802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

802

-

-

-

-

Overview

Unlock the power of innovation with the LM3S1937-IBZ50-A2T microcontroller from Texas Instruments. Designed with precision and reliability in mind, this advanced technology offers a wide range of applications in various industries. Experience seamless performance, unparalleled efficiency, and cutting-edge features that set this product apart from the rest. Trust in Texas Instruments to deliver exceptional quality and value, providing you with the tools you need to stay ahead in today's competitive market. Elevate your projects with the LM3S1937-IBZ50-A2T and discover endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient integration onto PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 2.75 V

Suitable for low-power applications while still providing enough voltage for efficient operation.

Bit Size: 32

Offers high performance for processing data and executing commands efficiently.

ADC Channels: YES

Enables the microcontroller to interface with analog sensors and inputs, expanding its capabilities.

ROM Words: 262144

Ample memory for storing program instructions and data, allowing for complex applications to be executed smoothly.

Technology: CMOS

Low power consumption and high noise immunity, making it suitable for battery-operated devices and industrial applications.

PWM Channels: YES

Enables the generation of analog voltage levels, useful for applications such as motor control and LED dimming.

Technical Specifications

Microcontrollers LM3S1937-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1937-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20