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LM3S1918-IQC50-A2T

Texas Instruments

LM3S1918-IQC50-A2T by Texas Instruments

LM3S1918-IQC50-A2T by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU family, featuring 64KB RAM and 262144 ROM words. With 8-channel 10-bit ADCs, it supports peripherals like BOR, POR, and timers for industrial applications requiring low power mode and fixed-point format at up to 0.032 MHz clock frequency.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,963 parts In-Stock

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Digiode

USA . 4,077 parts In-Stock

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4,077

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Distributors (Availability)

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AZTECH Wire

Italy . 776 parts In-Stock

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$12.951

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776

$12.951

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Ampacity Inc.

Singapore . 527 parts In-Stock

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$16.000

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527

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One Stop Electronics

USA . 640 parts In-Stock

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$18.000

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Parana Technologies

USA . 1,026 parts In-Stock

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$75.916

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$75.916

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ChromeModa Solutions

Germany . 498 parts In-Stock

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$85.299

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$69.945

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498

$85.299

$69.945

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IDEA Electronic Components Group

UK . 405 parts In-Stock

1+ parts

$85.299

100+ parts

$81.034

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$76.769

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405

$85.299

$81.034

$76.769

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Corphita

USA . 3,939 parts In-Stock

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DigiPath Technology Company

USA . 2,117 parts In-Stock

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$76.906

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Overview

Unlock endless possibilities with the LM3S1918-IQC50-A2T microcontroller by Texas Instruments. Designed with cutting-edge technology, this powerhouse device offers superior performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller provides unmatched value and efficiency. Trust in Texas Instruments' reputation for excellence and innovation, and experience the benefits of seamless connectivity, low power consumption, and high-speed processing. Elevate your projects with the LM3S1918-IQC50-A2T and see your ideas come to life like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring a longer lifespan and reliable performance.

Integrated Cache: YES

Integrated cache helps in improving the processing speed and efficiency of the microcontroller by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a maximum supply voltage of 2.75 V, making it suitable for low-power applications.

No. of Terminals: 100

Having a large number of terminals allows for multiple connectivity options and flexibility in interfacing with other components or devices.

CPU Family: CORTEX-M3

Built on the CORTEX-M3 architecture, which provides high performance and energy efficiency for a wide range of embedded applications.

ADC Channels: YES

Integrated analog-to-digital converter channels enable the microcontroller to easily interface with various sensors and capture analog data accurately.

ROM Words: 262144

Large ROM capacity of 262144 words allows for storing program instructions and data, accommodating complex algorithms and applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a RISC architecture ensures efficient processing and execution of instructions, enhancing overall system performance.

Analog To Digital Convertors: 8-Ch 10-Bit

Multiple analog-to-digital converter channels with 10-bit resolution provide accurate conversion of analog signals to digital values, essential for sensor interfacing.

Connectivity: I2C(2), IRDA, SSI(2), UART(2)

Various connectivity options such as I2C, IRDA, SSI, and UART facilitate communication with external devices, expanding the versatility of the microcontroller.

Technical Specifications

Microcontrollers LM3S1918-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

52

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

RAM Words:

64

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), IRDA, SSI(2), UART(2)"

Peripherals:

"BOR, COMPARATOR(2), POR, TIMER(5), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S1918-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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