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LM3S1918-IBZ50-A2T

Texas Instruments

LM3S1918-IBZ50-A2T by Texas Instruments

LM3S1918-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring up to 52 I/O lines and PWM channels. With a temperature range from -40 to 85 °C, it offers versatile performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,898 parts In-Stock

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5,898

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Digiode

USA . 1,910 parts In-Stock

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1,910

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 352 parts In-Stock

1+ parts

$4.000

100+ parts

-

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352

$4.000

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AZTECH Wire

Italy . 500 parts In-Stock

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$10.341

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500

$10.341

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Advanced Electronics

New Zealand . 93 parts In-Stock

1+ parts

$26.718

100+ parts

$24.313

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$21.909

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93

$26.718

$24.313

$21.909

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Microchip USA

USA . 3,121 parts In-Stock

1+ parts

$47.170

100+ parts

$46.500

1k+ parts

$46.160

10k+ parts

$45.830

3,121

$47.170

$46.500

$46.160

$45.830

Parana Technologies

USA . 739 parts In-Stock

1+ parts

$51.756

100+ parts

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739

$51.756

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ChromeModa Solutions

Germany . 3,385 parts In-Stock

1+ parts

$58.153

100+ parts

$47.685

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3,385

$58.153

$47.685

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IDEA Electronic Components Group

UK . 153 parts In-Stock

1+ parts

$58.153

100+ parts

$55.245

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$52.338

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153

$58.153

$55.245

$52.338

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Component Stockers USA

USA . 330 parts In-Stock

1+ parts

$99.990

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330

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 12,334 parts In-Stock

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12,334

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Corphita

USA . 1,611 parts In-Stock

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DigiPath Technology Company

USA . 821 parts In-Stock

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$52.431

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821

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$52.431

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Overview

Elevate your projects with the LM3S1918-IBZ50-A2T microcontroller by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology that pushes boundaries. This microcontroller is perfect for a wide range of applications, offering unparalleled performance and efficiency. Whether you're a seasoned professional or just starting out, this product provides exceptional value, benefits, and advantages to help you bring your ideas to life. Experience the difference with Texas Instruments LM3S1918-IBZ50-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material is lightweight and durable, making the product suitable for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly.

Maximum Supply Voltage: 2.75 V

Operates efficiently at a low maximum supply voltage, reducing power consumption.

Package Shape: SQUARE

Square package shape allows for easy orientation and placement on the PCB.

Bit Size: 32

32-bit architecture provides high processing power and efficiency.

No. of Terminals: 108

A large number of terminals provide versatile connectivity options.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures stable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range enables usage in extreme cold environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient processing and reduced power consumption.

Technical Specifications

Microcontrollers LM3S1918-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1918-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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