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LM3S1911-EQC50-A2T

Texas Instruments

LM3S1911-EQC50-A2T by Texas Instruments

LM3S1911-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it is ideal for industrial applications requiring a wide temperature range (-40 to 105 °C) and multiple PWM channels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,041 parts In-Stock

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Digiode

USA . 314 parts In-Stock

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314

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One Stop Electronics

USA . 239 parts In-Stock

1+ parts

$4.000

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239

$4.000

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AZTECH Wire

Italy . 846 parts In-Stock

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$12.701

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846

$12.701

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Parana Technologies

USA . 336 parts In-Stock

1+ parts

$18.816

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$18.900

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336

$18.816

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$18.900

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DigiPath Technology Company

USA . 74 parts In-Stock

1+ parts

$20.719

100+ parts

$19.062

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74

$20.719

$19.062

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ChromeModa Solutions

Germany . 5,556 parts In-Stock

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$21.142

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$17.336

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5,556

$21.142

$17.336

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IDEA Electronic Components Group

UK . 1,609 parts In-Stock

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$21.142

100+ parts

$20.085

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$19.028

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1,609

$21.142

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$19.028

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Corphita

USA . 958 parts In-Stock

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Microchip USA

USA . 163 parts In-Stock

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Overview

Elevate your projects with the LM3S1911-EQC50-A2T by Texas Instruments, a top-tier microcontroller that delivers unparalleled performance and reliability. Crafted by a renowned manufacturer in the industry, this microcontroller is designed to excel in a wide range of applications. From robotics to IoT devices, the LM3S1911-EQC50-A2T offers exceptional value, precision, and efficiency. Experience seamless integration, advanced features, and cutting-edge technology with this powerhouse of a microcontroller. Unlock endless possibilities and unleash your creativity with the LM3S1911-EQC50-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material offers durability and protection for the microcontroller, making it suitable for various applications and environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and resources during production.

Maximum Supply Voltage: 2.75 V

A maximum supply voltage of 2.75V ensures safe operation of the microcontroller within its specified limits, preventing damage from overvoltage.

Package Shape: SQUARE

Square package shape offers a compact form factor, optimizing space utilization on the PCB and enabling design flexibility.

Bit Size: 32

32-bit architecture provides high performance and processing capabilities, suitable for demanding applications that require fast and efficient data processing.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) enables compatibility with a wide range of systems and devices, enhancing versatility.

No. of Terminals: 100

Having 100 terminals allows for easy interfacing with other components and peripherals, facilitating connectivity and integration within a larger system.

Package Style (Meter): FLATPACK

Flatpack package style provides a low-profile design, saving space on the PCB and contributing to a more streamlined and compact overall system.

Minimum Supply Voltage: 2.25 V

A minimum supply voltage of 2.25V ensures reliable operation even under low voltage conditions, enhancing the microcontroller's performance and stability.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C allows the microcontroller to withstand elevated temperatures, making it suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable performance in cold environments, expanding the range of applications where the microcontroller can be used.

Terminal Finish: TIN

Tin terminal finish offers good conductivity and solderability, ensuring reliable electrical connections and ease of manufacturing.

ADC Channels: YES

Built-in ADC channels allow for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors and signals, expanding its versatility.

Terminal Position: QUAD

Quad terminal position facilitates easier PCB layout and soldering, improving manufacturing efficiency and reliability of connections.

ROM Words: 262144

Large ROM size of 262144 words provides ample storage for program code and data, allowing for complex algorithms and applications to be implemented.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6mm helps reduce overall profile of the PCB, contributing to a more compact and space-efficient design.

Width: 14 mm

With a width of 14mm, the microcontroller can fit into narrow spaces and compact designs, making it suitable for applications with space constraints.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032MHz enables fast processing and real-time performance, ideal for applications that require quick response times.

Length: 14 mm

Compact length of 14mm contributes to a small overall footprint, allowing for integration into tight spaces or smaller devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments with wide temperature fluctuations, making the microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers high performance and efficiency, suitable for applications that require fast execution of instructions and low power consumption.

RAM Bytes: 65536

Generous RAM size of 65536 bytes provides ample storage for data and variables during program execution, enabling complex computations and multitasking.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and inspection during manufacturing, ensuring high-quality solder joints and reliable connections.

Nominal Supply Voltage: 2.5 V

Nominal supply voltage of 2.5V provides a stable operating voltage for the microcontroller, ensuring consistent performance and reliable operation.

PWM Channels: YES

Support for PWM channels allows for precise control of analog signals, enabling the microcontroller to drive motors, LEDs, and other devices with adjustable output voltages.

ROM Programmability: FLASH

Flash ROM programmability enables easy and cost-effective firmware updates, allowing for flexibility and customization of the microcontroller's functionality.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density packaging and compact PCB designs, optimizing space utilization and enabling miniaturization of devices.

Moisture Sensitivity Level (MSL): 3

MSL rating of 3 indicates moderate sensitivity to moisture during storage and handling, requiring standard precautions to prevent damage to the microcontroller.

Speed: 50 rpm

Operational speed of 50rpm enables efficient data processing and communication, ensuring responsive performance in applications that require fast computation and interaction.

No. of I/O Lines: 60

Sixty I/O lines provide ample interfaces for connecting to external devices and peripherals, enabling versatile functionality and communication with the surrounding system.

Technical Specifications

Microcontrollers LM3S1911-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1911-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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