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LM3S1850-IBZ50-A2T

Texas Instruments

LM3S1850-IBZ50-A2T by Texas Instruments

LM3S1850-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring PWM channels and ADC channels. With a package style of GRID ARRAY and terminal finish of TIN SILVER COPPER, it offers versatile performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,967 parts In-Stock

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4,967

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Digiode

USA . 674 parts In-Stock

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674

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 835 parts In-Stock

1+ parts

$6.181

100+ parts

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835

$6.181

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One Stop Electronics

USA . 1,100 parts In-Stock

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$17.000

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$17.000

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Microchip USA

USA . 3,072 parts In-Stock

1+ parts

$43.860

100+ parts

$43.230

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$42.920

10k+ parts

$42.610

3,072

$43.860

$43.230

$42.920

$42.610

Parana Technologies

USA . 1,886 parts In-Stock

1+ parts

$72.610

100+ parts

$6,742.918

1k+ parts

$65.349

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1,886

$72.610

$6,742.918

$65.349

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DigiPath Technology Company

USA . 1,161 parts In-Stock

1+ parts

$79.952

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$73.556

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1,161

$79.952

$73.556

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ChromeModa Solutions

Germany . 6,806 parts In-Stock

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$81.584

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$66.899

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6,806

$81.584

$66.899

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IDEA Electronic Components Group

UK . 1,298 parts In-Stock

1+ parts

$81.584

100+ parts

$77.505

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$73.426

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1,298

$81.584

$77.505

$73.426

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Corphita

USA . 2,717 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S1850-IBZ50-A2T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge microcontrollers like this one that offer unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller provides customers with unmatched value, efficiency, and versatility. Whether you're looking to enhance your IoT devices or streamline your industrial processes, the LM3S1850-IBZ50-A2T is the perfect solution to take your projects to the next level. Elevate your designs with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, saving space on the PCB.

Maximum Supply Voltage: 2.75 V

This voltage limit ensures safe operation and protects the microcontroller from potential damage.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB and easy alignment during assembly.

Bit Size: 32

A 32-bit architecture provides higher performance and processing capabilities compared to lower bit sizes.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages offers flexibility in system design and compatibility with different components.

No. of Terminals: 108

Plenty of terminals allow for easy connection to other devices and peripherals, expanding the microcontroller's functionality.

Package Style (Meter): GRID ARRAY

Grid array style enables secure and reliable connections, ensuring stable performance in various operating conditions.

Minimum Supply Voltage: 2.25 V

A low minimum supply voltage allows for efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes the microcontroller suitable for industrial applications where temperature fluctuations occur.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the microcontroller can function in extreme environments without overheating or malfunctioning.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance for reliable connections and long-term performance.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, making it easier to integrate the microcontroller into a system.

ROM Words: 262144

Large ROM capacity allows for storing firmware and programs, accommodating complex algorithms and software requirements.

Maximum Seated Height: 1.5 mm

Low seated height ensures compatibility with slim and compact device designs, saving space and reducing overall product size.

Width: 10 mm

Compact width dimensions make the microcontroller suitable for applications with limited board space or size constraints.

Maximum Clock Frequency: 0.032 MHz

High clock frequency enables fast processing and real-time operation, enhancing the microcontroller's performance in time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

This time limit ensures proper solder reflow during assembly, preventing damage to the microcontroller and ensuring reliable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for safe and effective soldering during assembly, ensuring the longevity of the microcontroller.

Length: 10 mm

Compact length dimensions offer versatility in mounting options and integration into different device designs, making the microcontroller adaptable to various applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability and stability in harsh environments, making the microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient processing power and performance, making the microcontroller suitable for high-speed applications and real-time operation.

RAM Bytes: 32768

Generous RAM capacity allows for efficient data storage and processing, enabling the microcontroller to handle complex algorithms and multitasking operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Ball terminal form simplifies soldering and improves electrical connections, ensuring reliable performance and ease of assembly.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller in various applications and operating conditions.

PWM Channels: YES

Pulse width modulation channels provide precise control over output signals, making the microcontroller suitable for applications requiring accurate voltage and frequency adjustments.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware, enabling flexibility and customization in application development.

Terminal Pitch: 0.8 mm

Narrow terminal pitch facilitates high-density mounting and PCB layout, optimizing space usage and enabling compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, ensuring the microcontroller can withstand standard reflow soldering processes without damage.

Speed: 50 rpm

Operational speed of 50 revolutions per minute (rpm) ensures efficient performance in motor control applications and other speed-dependent operations.

No. of I/O Lines: 56

Abundance of input/output lines provides ample connectivity options for peripherals and external devices, enhancing the microcontroller's versatility and functionality.

Technical Specifications

Microcontrollers LM3S1850-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1850-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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