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LM3S1850-IBZ50-A2

Texas Instruments

LM3S1850-IBZ50-A2 by Texas Instruments

LM3S1850-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at a max frequency of 0.032 MHz. It features 32768 bytes of RAM, 262144 ROM words, and PWM channels for industrial applications requiring RISC technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,250 parts In-Stock

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Digiode

USA . 751 parts In-Stock

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751

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AZTECH Wire

Italy . 671 parts In-Stock

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$13.302

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671

$13.302

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One Stop Electronics

USA . 547 parts In-Stock

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$23.000

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$23.000

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Ampacity Inc.

Singapore . 230 parts In-Stock

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$28.000

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Microchip USA

USA . 2,701 parts In-Stock

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$50.000

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$49.290

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$48.930

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$48.570

2,701

$50.000

$49.290

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$48.570

Parana Technologies

USA . 1,051 parts In-Stock

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$62.825

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1,051

$62.825

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DigiPath Technology Company

USA . 551 parts In-Stock

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$69.178

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$63.644

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551

$69.178

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ChromeModa Solutions

Germany . 5,300 parts In-Stock

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$70.590

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$57.884

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IDEA Electronic Components Group

UK . 1,385 parts In-Stock

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$70.590

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$67.060

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$63.531

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Corphita

USA . 161 parts In-Stock

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Overview

Experience the cutting-edge technology of the LM3S1850-IBZ50-A2 microcontroller by Texas Instruments, a leader in innovation. With a powerful 32-bit processor and a wide range of applications in industries such as automotive, industrial automation, and consumer electronics, this product offers unmatched performance and reliability. Benefit from its low power consumption and versatile features, making it the ideal choice for your next project. Trust in Texas Instruments to deliver quality products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ensuring protection for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort.

Maximum Supply Voltage: 2.75 V

With a maximum supply voltage of 2.75V, this microcontroller is efficient and can handle varying power inputs effectively.

Package Shape: SQUARE

The square package shape makes it easy to fit into compact spaces in electronic devices, maximizing usability.

Bit Size: 32

The 32-bit size allows for higher computational power and performance, ideal for handling complex operations.

Power Supplies (V): 2.5, 3.3

Support for multiple power supply voltages (2.5V and 3.3V) provides flexibility in powering the microcontroller according to requirements.

No. of Terminals: 108

Having 108 terminals allows for versatile connection options to external components for enhanced functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers high density and efficient thermal performance, making it suitable for demanding applications.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25V ensures that the microcontroller can operate effectively even under lower power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable performance in challenging environments.

RAM Bytes: 32768

With 32768 bytes of RAM, the microcontroller can efficiently store and access data during processing, enhancing performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Technical Specifications

Microcontrollers LM3S1850-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1850-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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