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LM3S1850-EQC50-A2T

Texas Instruments

LM3S1850-EQC50-A2T by Texas Instruments

LM3S1850-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. Operating at up to 0.032 MHz, it features 56 I/O lines and PWM channels for industrial applications requiring a temperature range of -40 to 105 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,419 parts In-Stock

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Digiode

USA . 3,165 parts In-Stock

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AZTECH Wire

Italy . 302 parts In-Stock

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$17.427

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One Stop Electronics

USA . 1,526 parts In-Stock

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$23.000

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Parana Technologies

USA . 339 parts In-Stock

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$42.156

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339

$42.156

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ChromeModa Solutions

Germany . 4,835 parts In-Stock

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$47.366

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$38.840

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4,835

$47.366

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IDEA Electronic Components Group

UK . 1,695 parts In-Stock

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$47.366

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$44.998

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$42.629

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1,695

$47.366

$44.998

$42.629

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DigiPath Technology Company

USA . 2,164 parts In-Stock

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$42.705

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Corphita

USA . 2,114 parts In-Stock

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Microchip USA

USA . 235 parts In-Stock

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Overview

Unlock the potential of your next project with the Texas Instruments LM3S1850-EQC50-A2T microcontroller. Known for its exceptional quality and reliability, Texas Instruments delivers cutting-edge technology to meet your needs. This versatile microcontroller is perfect for a wide range of applications, offering unmatched performance and efficiency. With features like ADC channels, PWM channels, and a 32-bit RISC architecture, this product provides incredible value and flexibility. Trust Texas Instruments to deliver top-of-the-line solutions for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it ideal for various environments and applications.

Surface Mount: YES

Surface mount capability makes it easy to integrate into PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 2.75 V

Operating within a maximum supply voltage of 2.75V ensures stable performance and prevents damage to the microcontroller.

Package Shape: SQUARE

Square package shape allows for easy placement and efficient use of space on the PCB.

Bit Size: 32

32-bit architecture provides enhanced processing power and efficiency, suitable for complex applications that require high performance.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) offers flexibility in designing and powering the microcontroller.

No. of Terminals: 100

Having 100 terminals allows for a high level of connectivity and interfacing with other components in the system.

Package Style (Meter): FLATPACK

Flatpack package style facilitates easy handling and installation of the microcontroller on the PCB.

Minimum Supply Voltage: 2.25 V

Maintaining a minimum supply voltage of 2.25V ensures reliable operation and prevents voltage-related issues.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, the microcontroller can function in high-temperature environments without overheating.

Minimum Operating Temperature: -40 °C

Ability to operate at temperatures as low as -40°C makes the microcontroller suitable for use in extreme cold conditions.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, expanding the range of applications where the microcontroller can be used.

Terminal Position: QUAD

Quad terminal position simplifies the layout and routing of connections on the PCB, making installation and assembly more straightforward.

ROM Words: 262144

Large ROM capacity of 262144 words allows for storing and executing a significant amount of code and data.

Maximum Seated Height: 1.6 mm

Low seated height of 1.6mm enables compact and slim designs when integrating the microcontroller into a system.

Width: 14 mm

With a width of 14mm, the microcontroller maintains a compact form factor, suitable for space-constrained applications.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032MHz allows for fast and responsive operation of the microcontroller.

Length: 14 mm

Length of 14mm contributes to the overall compact size of the microcontroller, making it easier to integrate into tight spaces.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable performance in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture combined with microcontroller functionality provides efficient processing power and control for diverse applications.

RAM Bytes: 32768

Generous RAM capacity of 32768 bytes supports data storage and processing capabilities for complex algorithms and applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller efficient and reliable in operation.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and reliable connections during the assembly process.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5V ensures stable and consistent power delivery to the microcontroller.

PWM Channels: YES

Integrated PWM channels allow for precise control of analog signals, enabling the microcontroller to drive motors and other devices with varying power levels.

ROM Programmability: FLASH

Flash ROM programmability provides flexibility in updating and reprogramming the code stored in ROM, essential for software development and updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and connection with other components, maximizing space efficiency on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller is sensitive to moisture but can withstand standard solder reflow processes, ensuring reliability during assembly.

Speed: 50 rpm

Speed rating of 50rpm reflects the performance capabilities of the microcontroller in terms of processing speed and execution of instructions.

No. of I/O Lines: 56

Having 56 I/O lines allows for versatile input and output configurations, enabling the microcontroller to interface with a wide range of external devices and sensors.

Technical Specifications

Microcontrollers LM3S1850-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1850-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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