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LM3S1816-IQR50-C5T

Texas Instruments

LM3S1816-IQR50-C5T by Texas Instruments

Texas Instruments LM3S1816-IQR50-C5T is a 32-bit Cortex-M3 microcontroller with 262144 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 16.384 MHz, suitable for industrial applications requiring high-speed processing and low power consumption. The package style is flatpack, low profile, fine pitch, making it ideal for compact designs in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,551 parts In-Stock

1+ parts

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8,551

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Digiode

USA . 1,053 parts In-Stock

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1,053

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Distributors (Availability)

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AZTECH Wire

Italy . 692 parts In-Stock

1+ parts

$13.790

100+ parts

-

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692

$13.790

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One Stop Electronics

USA . 1,097 parts In-Stock

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$18.000

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1,097

$18.000

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Parana Technologies

USA . 1,538 parts In-Stock

1+ parts

$48.978

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1,538

$48.978

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ChromeModa Solutions

Germany . 3,323 parts In-Stock

1+ parts

$55.031

100+ parts

$45.125

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3,323

$55.031

$45.125

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IDEA Electronic Components Group

UK . 519 parts In-Stock

1+ parts

$55.031

100+ parts

$52.279

1k+ parts

$49.528

10k+ parts

-

519

$55.031

$52.279

$49.528

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Microchip USA

USA . 5,151 parts In-Stock

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5,151

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Corphita

USA . 2,484 parts In-Stock

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2,484

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DigiPath Technology Company

USA . 1,625 parts In-Stock

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$49.616

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1,625

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$49.616

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Overview

Unlock the full potential of your projects with the LM3S1816-IQR50-C5T microcontroller from Texas Instruments, a leading manufacturer in the industry. Perfect for a wide range of applications, this powerful 32-bit device offers unmatched performance and reliability. With features like ADC and DMA channels, PWM capabilities, and a compact design, this microcontroller provides exceptional value for customers seeking high-quality solutions. Upgrade your projects today with the LM3S1816-IQR50-C5T and experience the difference that Texas Instruments can make in your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers high performance and efficient processing capabilities.

Power Supplies (V): 1.2, 3.3

Supports multiple power supply options, allowing flexibility in design and power management.

Maximum Operating Temperature: 85 °C

Can operate efficiently in higher temperature environments, suitable for industrial applications.

CPU Family: CORTEX-M3

Based on the Cortex-M3 architecture, offering a good balance of performance and power efficiency.

ROM Words: 262144

Large ROM capacity for storing program code, data, and firmware, enabling versatile applications.

RAM Bytes: 32768

Sufficient RAM for data storage and processing, facilitating smooth operation of the microcontroller.

PWM Channels: YES

Support for Pulse Width Modulation (PWM) channels enables precise control of analog signals, ideal for motor control and power management.

Technical Specifications

Microcontrollers LM3S1816-IQR50-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1816-IQR50-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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