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LM3S1816-IQR50-C3T

Texas Instruments

LM3S1816-IQR50-C3T by Texas Instruments

LM3S1816-IQR50-C3T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 16 MHz, making it ideal for industrial applications requiring high-speed processing. With features like ADC and PWM channels, this microcontroller is suitable for tasks that demand precise analog-to-digital conversion and pulse-width modulation control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,379 parts In-Stock

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8,379

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Digiode

USA . 2,782 parts In-Stock

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2,782

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,634 parts In-Stock

1+ parts

$4.000

100+ parts

-

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1,634

$4.000

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AZTECH Wire

Italy . 734 parts In-Stock

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$7.199

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734

$7.199

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Semicontronic

India . 1,213 parts In-Stock

1+ parts

$10.000

100+ parts

$9.750

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$9.700

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-

1,213

$10.000

$9.750

$9.700

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Ampacity Inc.

Singapore . 166 parts In-Stock

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$32.000

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166

$32.000

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Parana Technologies

USA . 500 parts In-Stock

1+ parts

$63.628

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500

$63.628

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ChromeModa Solutions

Germany . 5,812 parts In-Stock

1+ parts

$71.492

100+ parts

$58.623

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5,812

$71.492

$58.623

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IDEA Electronic Components Group

UK . 653 parts In-Stock

1+ parts

$71.492

100+ parts

$67.917

1k+ parts

$64.343

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653

$71.492

$67.917

$64.343

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Corphita

USA . 2,304 parts In-Stock

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2,304

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DigiPath Technology Company

USA . 1,816 parts In-Stock

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$64.457

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1,816

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$64.457

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Corohmni

South Africa . 464 parts In-Stock

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464

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Microchip USA

USA . 227 parts In-Stock

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Overview

Unlock a world of possibilities with the LM3S1816-IQR50-C3T by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge microcontrollers like this one, perfect for a wide range of applications. With its advanced features and capabilities, this microcontroller offers unmatched value and benefits to customers looking for high-performance solutions. Experience seamless operation and enhanced functionality with the LM3S1816-IQR50-C3T, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 3.6V

With a maximum supply voltage of 3.6V, this microcontroller can handle higher voltage inputs, providing flexibility in power supply options.

Package Shape: SQUARE

The square package shape allows for easier PCB layout and integration, optimizing space efficiency in electronic designs.

Bit Size: 32

A 32-bit architecture provides increased processing power and capability, suitable for complex applications and tasks.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply voltages allows for compatibility with various power sources, offering flexibility in system design.

No. of Terminals: 64

More terminals mean more connectivity options and peripherals can be implemented, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK

Flatpack package style offers a low profile and compact design, suitable for space-constrained applications and compact electronic devices.

Minimum Supply Voltage: 3V

A minimum supply voltage of 3V ensures compatibility with a wide range of power sources, providing reliability in different operating conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and temperature fluctuations, ensuring reliability in various applications.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers efficient processing performance and low power consumption, making it ideal for battery-powered devices and resource-efficient applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this microcontroller to operate in cold environments, providing reliability in extreme temperature conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and good solderability, ensuring reliable connections and longevity of the microcontroller.

ADC Channels: YES

Analog-to-digital converter channels allow for interfacing with analog sensors and signals, enabling a wide range of sensor-based applications and data acquisition.

DMA Channels: YES

Direct memory access channels enable efficient data transfer and processing, improving system performance and reducing CPU load for multitasking operations.

Terminal Position: QUAD

Quad terminal positioning offers better mechanical stability and easier soldering during assembly, ensuring reliable connections and robustness in operation.

ROM Words: 262144

The large ROM capacity of 262144 words allows for extensive program storage and firmware customization, suitable for complex software applications and algorithms.

Maximum Seated Height: 1.6 mm

A low maximum seated height promotes a compact and slim design, facilitating integration into thin devices and space-constrained applications.

Width: 10 mm

With a width of 10mm, this microcontroller offers a compact form factor, ideal for small electronic devices and applications where space is limited.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides fast processing speeds and real-time operation, suitable for time-critical applications and high-speed data processing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures safe and efficient soldering during assembly, preventing damage to the microcontroller and ensuring reliable connections.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this microcontroller can withstand high-temperature soldering processes, ensuring reliable assembly and solder joint integrity.

Length: 10 mm

A length of 10mm offers a compact and space-saving design, suitable for small electronic devices and applications where size constraints are a concern.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, providing robust performance and longevity in demanding conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product combines processing capabilities with built-in peripherals, enabling standalone operation and control in various electronic systems and devices.

RAM Bytes: 32768

A RAM capacity of 32768 bytes allows for efficient data storage and manipulation, enabling multitasking, data processing, and temporary data storage in the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable operation, making this microcontroller energy-efficient and suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form provides secure mounting and easy soldering during assembly, ensuring mechanical stability and reliable connections for the microcontroller.

Nominal Supply Voltage: 3.3V

A nominal supply voltage of 3.3V ensures stable and efficient operation, providing compatibility with common power sources and ease of integration into various electronic systems.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of analog outputs, making this microcontroller suitable for applications such as motor control, LED dimming, and audio modulation.

ROM Programmability: FLASH

Flash ROM programmability enables easy and flexible firmware updates and customization, facilitating quick iterations and improvements in the microcontroller's software functionality.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm provides fine-pitch connections for space-efficient PCB layout, enabling high-density integration of components and reducing the overall size of electronic devices.

Moisture Sensitivity Level (MSL): 3

An MSL level of 3 indicates that this microcontroller is sensitive to moisture, requiring proper handling and storage to prevent damage during assembly and operation.

Speed: 50 rpm

With a 50 rpm speed, this microcontroller offers fast processing and response times, suitable for applications requiring quick data manipulation and real-time control.

No. of I/O Lines: 33

With 33 input/output lines, this microcontroller provides ample connectivity options for interfacing with external devices and peripherals, enabling versatile system integration and control.

Technical Specifications

Microcontrollers LM3S1816-IQR50-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1816-IQR50-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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