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LM3S1816-IQR50-C3

Texas Instruments

LM3S1816-IQR50-C3 by Texas Instruments

LM3S1816-IQR50-C3 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features 32768 bytes of RAM, ADC and DMA channels, and ROM programmability via FLASH. Ideal for industrial applications requiring a powerful yet compact solution with a wide temperature range from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,171 parts In-Stock

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Digiode

USA . 1,142 parts In-Stock

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

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50

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ComSIT USA

USA . 50 parts In-Stock

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50

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Distributors (Availability)

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AZTECH Wire

Italy . 229 parts In-Stock

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$8.043

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$8.043

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One Stop Electronics

USA . 367 parts In-Stock

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$16.000

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367

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Parana Technologies

USA . 95 parts In-Stock

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$30.589

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$2,840.680

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$27.530

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95

$30.589

$2,840.680

$27.530

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DigiPath Technology Company

USA . 2,051 parts In-Stock

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$33.683

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$30.988

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2,051

$33.683

$30.988

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ChromeModa Solutions

Germany . 5,211 parts In-Stock

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$34.370

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$28.183

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$34.370

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IDEA Electronic Components Group

UK . 619 parts In-Stock

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$34.370

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$32.652

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$30.933

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619

$34.370

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$30.933

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Lixinc

USA . 11,539 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Corphita

USA . 4,070 parts In-Stock

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Microchip USA

USA . 400 parts In-Stock

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Kepictronics

USA . 148 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S1816-IQR50-C3 microcontroller from Texas Instruments. Boasting cutting-edge technology and exceptional quality, this product offers unmatched performance for a wide range of applications. Whether you're designing innovative IoT devices, advanced robotics, or high-performance industrial equipment, this microcontroller delivers superior efficiency and reliability. Transform your projects with the value, benefits, and advantages that only Texas Instruments can provide. Step into the future of technology with the LM3S1816-IQR50-C3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lightweight and durable, perfect for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage ensures compatibility with a wide range of power sources, offering flexibility in design.

Package Shape: SQUARE

The square package shape provides uniformity and simplicity in layout design, making it easier to arrange multiple components on a board.

Bit Size: 32

A 32-bit architecture allows for faster processing speeds and more memory capacity compared to lower bit sizes, enabling better performance.

Power Supplies (V): 1.2,3.3

The availability of multiple power supply options gives the designer the flexibility to optimize power consumption based on the application's requirements.

No. of Terminals: 64

Having 64 terminals allows for a higher number of input/output connections, enabling the microcontroller to interface with a variety of external devices.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile design, ideal for space-constrained applications where height is a concern.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions without sacrificing performance.

CPU Family: CORTEX-M3

Belonging to the Cortex-M3 family indicates that the microcontroller is based on a proven and efficient architecture, ensuring reliable and consistent performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to operate in cold environments without any issues, making it suitable for a wide range of applications.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals into digital data, expanding its compatibility with sensors and other analog devices.

DMA Channels: YES

Having DMA channels allows for direct memory access, reducing the workload on the CPU and improving overall system performance.

Terminal Position: QUAD

The quad terminal position simplifies the connection process and ensures secure and stable connections between the microcontroller and external components.

ROM Words: 262144

With a large ROM capacity, this microcontroller can store a significant amount of program memory, accommodating complex software requirements.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for a compact overall design, making the microcontroller suitable for slim and space-constrained applications.

Width: 10 mm

The compact width of 10 mm enables efficient PCB layout and compact system designs, saving space in the overall product design.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16 MHz ensures fast and efficient processing, making the microcontroller suitable for applications requiring real-time data processing.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand peak reflow temperatures for up to 30 seconds ensures reliable soldering during the assembly process, leading to robust and durable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for the use of lead-free soldering processes, making the microcontroller environmentally friendly and compliant with regulations.

Length: 10 mm

The compact length of 10 mm contributes to a smaller overall footprint, enabling the microcontroller to be integrated into space-constrained applications.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this microcontroller is designed to operate reliably in harsh industrial environments, ensuring long-term performance and durability.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various peripheral integration, this product offers a versatile and cost-effective solution for a wide range of applications.

RAM Bytes: 32768

The generous RAM capacity of 32768 bytes provides ample space for data storage and processing, allowing for efficient multitasking and data handling.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the microcontroller efficient and reliable for battery-powered applications.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process and ensures reliable connections, contributing to the overall durability and quality of the product.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides stable operation and compatibility with common power sources, making integration into existing systems easier.

PWM Channels: YES

Support for PWM channels allows the microcontroller to generate analog-like output signals, enabling precise control of various devices such as motors and LED brightness.

ROM Programmability: FLASH

The use of flash ROM allows for easy programmability and reprogramming of the microcontroller, facilitating quick updates and modifications to the software.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting and precise connections, making the microcontroller suitable for compact and intricate designs.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this microcontroller can withstand exposure to moderate levels of moisture during storage and assembly, ensuring reliability under varied environmental conditions.

Speed: 50 rpm

The speed of 50 rpm indicates the data processing capability of the microcontroller, allowing for quick execution of commands and efficient operation of the connected devices.

No. of I/O Lines: 33

Having 33 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, making the microcontroller versatile and adaptable to different applications.

Technical Specifications

Microcontrollers LM3S1816-IQR50-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1816-IQR50-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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