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LM3S1811-IQC50-C3

Texas Instruments

LM3S1811-IQC50-C3 by Texas Instruments

LM3S1811-IQC50-C3 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring up to 67 I/O lines and PWM channels. The microcontroller features ADC and DMA channels, with a temperature range from -40°C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,650 parts In-Stock

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8,650

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Digiode

USA . 3,793 parts In-Stock

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3,793

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Distributors (Availability)

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AZTECH Wire

Italy . 726 parts In-Stock

1+ parts

$14.494

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726

$14.494

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One Stop Electronics

USA . 711 parts In-Stock

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$31.000

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711

$31.000

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Parana Technologies

USA . 2,155 parts In-Stock

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$35.410

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2,155

$35.410

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DigiPath Technology Company

USA . 1,795 parts In-Stock

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$38.991

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1,795

$38.991

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ChromeModa Solutions

Germany . 5,821 parts In-Stock

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$39.787

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$32.625

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5,821

$39.787

$32.625

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IDEA Electronic Components Group

UK . 986 parts In-Stock

1+ parts

$39.787

100+ parts

$37.798

1k+ parts

$35.808

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986

$39.787

$37.798

$35.808

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Authorized Procurement Solutions

USA . 216,000 parts In-Stock

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216,000

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Lixinc

USA . 13,055 parts In-Stock

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13,055

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Glotronic Ltd.

UK . 9,000 parts In-Stock

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9,000

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Corphita

USA . 3,762 parts In-Stock

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3,762

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Assy Fe

Spain . 1,000 parts In-Stock

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Microchip USA

USA . 329 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S1811-IQC50-C3 microcontroller by Texas Instruments. Designed with cutting-edge technology and precision engineering, this versatile device is perfect for a wide range of applications. From industrial automation to consumer electronics, this microcontroller offers exceptional performance and reliability. Trust in Texas Instruments' reputation for quality and experience the value and benefits of the LM3S1811-IQC50-C3 for all your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle higher voltage applications without getting damaged.

Package Shape: SQUARE

Square package shape allows for a compact design, making it easier to integrate into smaller electronic devices.

Bit Size: 32

32-bit architecture provides higher processing power and efficiency compared to lower bit sizes, making it suitable for complex applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows for flexibility in system design and compatibility with different power sources.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for peripherals and external components, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK

Flatpack package style offers a low profile and efficient thermal performance, ideal for space-constrained applications.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures stable operation even in low power conditions, increasing the reliability of the microcontroller.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures that the microcontroller remains operational in cold conditions, making it suitable for a wide range of applications.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion, allowing the microcontroller to interface with sensors and other analog devices.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce processor workload, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position provides easy access and connectivity for external components, simplifying the PCB layout and design.

ROM Words: 262144

Large ROM capacity of 262144 words stores program instructions and data, enabling the microcontroller to execute complex algorithms and tasks.

Maximum Seated Height: 1.6 mm

Low seated height of 1.6mm allows for compact and slim designs, making it suitable for space-constrained applications.

Width: 14 mm

With a width of 14mm, this microcontroller can easily fit into standard PCB layouts and enclosure designs.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16MHz allows for fast processing and operation, making it suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering during production and assembly processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C is suitable for lead-free soldering processes, meeting industry standards for environmental compliance.

Length: 14 mm

With a length of 14mm, this microcontroller has a compact form factor that can easily integrate into small electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions, making it suitable for industrial automation and control applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for the peripheral IC type provides efficient and optimized processing, improving overall system performance and responsiveness.

RAM Bytes: 32768

With 32768 bytes of RAM, this microcontroller can efficiently store and access data during program execution, enhancing operational efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable for various applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder joints and reliable connections, ensuring stable operation in harsh environments.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V ensures compatibility with standard power sources, simplifying system integration and design.

PWM Channels: YES

Support for PWM channels enables pulse-width modulation for precise control of motors, actuators, and other output devices.

ROM Programmability: FLASH

ROM programmability using flash memory allows for easy and efficient updating of firmware and software, enhancing the flexibility and versatility of the microcontroller.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5mm enables high-density PCB designs and compact layouts, saving space and reducing overall system size.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate moisture sensitivity, requiring standard handling and storage procedures to prevent component damage.

Speed: 50 rpm

Operating speed of 50rpm ensures efficient data processing and execution, meeting the performance requirements of various applications.

No. of I/O Lines: 67

Having 67 I/O lines provides flexible connectivity options for interfacing with external devices, sensors, and peripherals, enhancing the functionality of the microcontroller.

Technical Specifications

Microcontrollers LM3S1811-IQC50-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1811-IQC50-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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