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LM3S1776-IQR50-A0

Texas Instruments

LM3S1776-IQR50-A0 by Texas Instruments

Texas Instruments LM3S1776-IQR50-A0 microcontroller features 32-bit CPU, 131072 ROM words, and 65536 RAM bytes. Ideal for industrial applications requiring low power consumption, it offers 6-Ch 10-Bit ADC channels, PWM(8), TIMER(3), and connectivity options like I2C and UART.

Median Price

$15.630

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$13.530

1k+ parts

$12.100

10k+ parts

$11.390

480

-

$13.530

$12.100

$11.390

DigiKey

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$15.630

1k+ parts

-

10k+ parts

-

480

-

$15.630

-

-

Verical

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$16.913

1k+ parts

$15.125

10k+ parts

$14.238

480

-

$16.913

$15.125

$14.238

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,172 parts In-Stock

1+ parts

$14.278

100+ parts

-

1k+ parts

-

10k+ parts

-

3,172

$14.278

-

-

-

Vyrian

USA . 4,773 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,773

-

-

-

-

DigiKey Marketplace

USA . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

480

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,368 parts In-Stock

1+ parts

$13.527

100+ parts

-

1k+ parts

-

10k+ parts

-

4,368

$13.527

-

-

-

Parana Technologies

USA . 1,864 parts In-Stock

1+ parts

$74.242

100+ parts

-

1k+ parts

-

10k+ parts

-

1,864

$74.242

-

-

-

ChromeModa Solutions

Germany . 5,931 parts In-Stock

1+ parts

$83.418

100+ parts

$68.403

1k+ parts

-

10k+ parts

-

5,931

$83.418

$68.403

-

-

IDEA Electronic Components Group

UK . 1,999 parts In-Stock

1+ parts

$83.418

100+ parts

$79.247

1k+ parts

$75.076

10k+ parts

-

1,999

$83.418

$79.247

$75.076

-

QUARKTWIN TECHNOLOGY LTD

USA . 22,808 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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22,808

-

-

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-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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2,500

-

-

-

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DigiPath Technology Company

USA . 2,064 parts In-Stock

1+ parts

-

100+ parts

$75.210

1k+ parts

-

10k+ parts

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2,064

-

$75.210

-

-

Microchip USA

USA . 462 parts In-Stock

1+ parts

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100+ parts

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462

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Metaverse IC Inc.

Canada . 257 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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257

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Kepictronics

USA . 157 parts In-Stock

1+ parts

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157

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Overview

Experience cutting-edge technology with the LM3S1776-IQR50-A0 microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in their products. The LM3S1776-IQR50-A0 is perfect for a wide range of applications, offering unparalleled performance and efficiency. Say goodbye to slow processing speeds and hello to seamless operation with this advanced microcontroller. Upgrade your projects today and unlock a world of possibilities with the LM3S1776-IQR50-A0.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the microcontroller, making it suitable for various applications.

Integrated Cache: YES

The integrated cache helps in improving the processing speed and overall performance of the microcontroller.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V allows for efficient power handling while ensuring safe operation of the microcontroller.

ROM Words: 131072

With a large ROM capacity of 131072 words, this microcontroller can store a significant amount of program instructions and data, enabling complex applications to run smoothly.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripherals, it offers efficient and optimized processing for a wide range of applications.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and signals, enhancing its versatility for applications requiring analog data processing.

Connectivity: I2C, SSI, UART

The multiple connectivity options including I2C, SSI, and UART enable seamless communication with other devices or peripherals, expanding the versatility of the microcontroller.

Technical Specifications

Microcontrollers LM3S1776-IQR50-A0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI, UART

Peripherals:

DMA, PWM(8), TIMER(3), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

LM3S1776-IQR50-A0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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