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LM3S1637-IBZ50-A2

Texas Instruments

LM3S1637-IBZ50-A2 by Texas Instruments

LM3S1637-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a package style of GRID ARRAY and terminal finish of TIN SILVER COPPER, it offers versatile connectivity options in compact dimensions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,351 parts In-Stock

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9,351

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Digiode

USA . 464 parts In-Stock

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464

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,507 parts In-Stock

1+ parts

$1.000

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1,507

$1.000

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AZTECH Wire

Italy . 792 parts In-Stock

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$17.694

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792

$17.694

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One Stop Electronics

USA . 508 parts In-Stock

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$35.000

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508

$35.000

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Microchip USA

USA . 1,492 parts In-Stock

1+ parts

$47.030

100+ parts

$46.360

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$46.020

10k+ parts

$45.690

1,492

$47.030

$46.360

$46.020

$45.690

Parana Technologies

USA . 2,270 parts In-Stock

1+ parts

$52.418

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2,270

$52.418

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DigiPath Technology Company

USA . 1,752 parts In-Stock

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$57.719

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1,752

$57.719

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ChromeModa Solutions

Germany . 6,168 parts In-Stock

1+ parts

$58.897

100+ parts

$48.296

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6,168

$58.897

$48.296

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IDEA Electronic Components Group

UK . 1,032 parts In-Stock

1+ parts

$58.897

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$55.952

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$53.007

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1,032

$58.897

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$53.007

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Component Stockers USA

USA . 569 parts In-Stock

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$99.990

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569

$99.990

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Corphita

USA . 3,383 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments LM3S1637-IBZ50-A2 microcontroller! Crafted by a trusted manufacturer, this powerful device offers unparalleled performance and reliability. Whether you're creating innovative IoT devices, smart appliances, or robotics, this microcontroller delivers seamless operation and efficiency. Embrace the future of technology with the LM3S1637-IBZ50-A2 and experience the ultimate in quality, value, and cutting-edge capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and reliability for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 2.75 V

Operates at a maximum supply voltage of 2.75 V for efficient power consumption.

Package Shape: SQUARE

Square package shape allows for compact integration into electronic devices.

Bit Size: 32

32-bit architecture provides high processing power and performance.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options for flexibility in design.

No. of Terminals: 108

Plenty of terminals for easy connectivity to external components.

Package Style (Meter): GRID ARRAY

Grid array package style allows for efficient routing of signals.

Minimum Supply Voltage: 2.25 V

Can operate at a low minimum supply voltage of 2.25 V for energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range of -40 to 85°C for versatility.

Terminal Finish: TIN SILVER COPPER

High-quality terminal finish for reliable electrical connections.

ADC Channels: YES

Built-in ADC channels for analog signal processing.

Terminal Position: BOTTOM

Bottom terminal position for convenient PCB layout.

ROM Words: 131072

Large ROM capacity of 131072 words for program storage.

Maximum Seated Height: 1.5 mm

Low profile with a maximum seated height of 1.5 mm for space-constrained designs.

Width: 10 mm

Compact width of 10 mm for easy integration into PCBs.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032 MHz for fast processing speed.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for up to 30 seconds during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C for soldering process.

Length: 10 mm

Compact length of 10 mm for space-saving designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating for reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing and control.

RAM Bytes: 32768

Large RAM capacity of 32768 bytes for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for reliable solder connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5 V for consistent operation.

PWM Channels: YES

Supports PWM channels for precise control of output signals.

ROM Programmability: FLASH

Flash ROM programmability for easy and quick updates to firmware.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8 mm for compact layout on PCBs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 for safe handling and storage.

Speed: 50 rpm

Operates at a speed of 50 rpm for precise timing and control.

No. of I/O Lines: 43

Plenty of I/O lines for versatile connectivity and interfacing with external devices.

Technical Specifications

Microcontrollers LM3S1637-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

43

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1637-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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