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LM3S1637-EQC50-A2

Texas Instruments

LM3S1637-EQC50-A2 by Texas Instruments

Texas Instruments' LM3S1637-EQC50-A2 is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 0.032 MHz, it features 43 I/O lines and PWM channels for industrial applications requiring a temperature range of -40 to 105 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,151 parts In-Stock

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4,151

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Vyrian

USA . 3,363 parts In-Stock

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3,363

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Distributors (Availability)

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AZTECH Wire

Italy . 730 parts In-Stock

1+ parts

$16.098

100+ parts

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730

$16.098

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One Stop Electronics

USA . 1,485 parts In-Stock

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$32.000

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1,485

$32.000

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Parana Technologies

USA . 1,317 parts In-Stock

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$72.709

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1,317

$72.709

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DigiPath Technology Company

USA . 850 parts In-Stock

1+ parts

$80.062

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850

$80.062

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ChromeModa Solutions

Germany . 4,729 parts In-Stock

1+ parts

$81.696

100+ parts

$66.991

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4,729

$81.696

$66.991

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IDEA Electronic Components Group

UK . 1,897 parts In-Stock

1+ parts

$81.696

100+ parts

$77.611

1k+ parts

$73.526

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1,897

$81.696

$77.611

$73.526

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Corphita

USA . 1,352 parts In-Stock

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1,352

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Microchip USA

USA . 449 parts In-Stock

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449

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Overview

Unlock the power of innovation with the Texas Instruments LM3S1637-EQC50-A2 microcontroller, a cutting-edge solution that offers unparalleled quality and reliability. Designed by a trusted manufacturer, this product is perfect for a wide range of applications in various industries. With impressive features such as high performance, low power consumption, and advanced technology, this microcontroller provides immense value and benefits to customers looking to enhance their products. Trust the LM3S1637-EQC50-A2 to deliver superior results and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Maximum Supply Voltage: 2.75 V

Allows for flexibility in power input while ensuring safe operation within specified limits.

Bit Size: 32

Provides sufficient processing power for handling complex tasks and calculations.

ROM Words: 131072

Ample memory capacity for storing program instructions and data.

Power Supplies (V): 2.5,3.3

Supports a range of supply voltages for compatibility with different power sources.

ADC Channels: YES

Ability to interface with analog sensors and devices for diverse input processing.

RAM Bytes: 32768

Sufficient random-access memory for data storage and manipulation during program execution.

Maximum Clock Frequency: 0.032 MHz

High clock speed for fast and responsive operation of the microcontroller.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperatures.

Technical Specifications

Microcontrollers LM3S1637-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

43

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1637-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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