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LM3S1636-IQC50-A2T

Texas Instruments

LM3S1636-IQC50-A2T by Texas Instruments

Texas Instruments' LM3S1636-IQC50-A2T is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 8.192 MHz, it features 56 I/O lines and PWM channels for industrial applications requiring high-speed processing in a compact, low-profile package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,019 parts In-Stock

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Digiode

USA . 4,918 parts In-Stock

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4,918

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One Stop Electronics

USA . 486 parts In-Stock

1+ parts

$1.000

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486

$1.000

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AZTECH Wire

Italy . 585 parts In-Stock

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$10.933

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585

$10.933

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Parana Technologies

USA . 2,239 parts In-Stock

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$51.795

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$51.795

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DigiPath Technology Company

USA . 943 parts In-Stock

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$57.033

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943

$57.033

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ChromeModa Solutions

Germany . 2,538 parts In-Stock

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$58.197

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$47.722

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2,538

$58.197

$47.722

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IDEA Electronic Components Group

UK . 101 parts In-Stock

1+ parts

$58.197

100+ parts

$55.287

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$52.377

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101

$58.197

$55.287

$52.377

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Corphita

USA . 2,203 parts In-Stock

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Microchip USA

USA . 495 parts In-Stock

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495

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Overview

Experience unmatched quality and innovation with the LM3S1636-IQC50-A2T by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers top-of-the-line products that push boundaries and exceed expectations. Ideal for a wide range of applications, this microcontroller offers unparalleled value, benefits, and advantages to customers looking for reliable and high-performance solutions. Discover the power of Texas Instruments and revolutionize your projects with the LM3S1636-IQC50-A2T today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications, making it energy efficient.

Bit Size: 32

Offers high computational capabilities for processing complex tasks efficiently.

Power Supplies (V): 2.5,3.3

Provides flexibility in power options, allowing compatibility with different power sources.

No. of Terminals: 100

Sufficient number of terminals for connecting to various external components and peripherals.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments without performance issues.

ADC Channels: YES

Allows for analog to digital conversion, enabling the microcontroller to interact with analog sensors and devices.

ROM Words: 131072

Large memory capacity for storing program instructions and data.

Maximum Clock Frequency: 8.192 MHz

High clock frequency for fast and responsive operation.

RAM Bytes: 32768

Sufficient memory for data storage and processing, improving overall performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

PWM Channels: YES

Supports Pulse Width Modulation for accurate control of analog devices such as motors and LEDs.

Technical Specifications

Microcontrollers LM3S1636-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

56

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1636-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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