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LM3S1621-IQC80-C5

Texas Instruments

LM3S1621-IQC80-C5 by Texas Instruments

LM3S1621-IQC80-C5 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words, 32768 RAM bytes, and 67 I/O lines. It operates at a max clock frequency of 16 MHz and has ADC and DMA channels for versatile applications in industrial settings. With a compact square package style and low profile height of 1.6 mm, it is ideal for space-constrained designs requiring high-speed processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,553 parts In-Stock

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Digiode

USA . 1,083 parts In-Stock

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1,083

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Distributors (Availability)

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One Stop Electronics

USA . 226 parts In-Stock

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$5.000

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226

$5.000

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AZTECH Wire

Italy . 514 parts In-Stock

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$11.692

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Parana Technologies

USA . 812 parts In-Stock

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$32.114

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$98.392

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$32.114

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$98.392

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IDEA Electronic Components Group

UK . 2,150 parts In-Stock

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$36.083

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$34.279

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$32.475

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2,150

$36.083

$34.279

$32.475

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ChromeModa Solutions

Germany . 2,017 parts In-Stock

1+ parts

$36.083

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$29.588

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2,017

$36.083

$29.588

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QUARKTWIN TECHNOLOGY LTD

USA . 6,006 parts In-Stock

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Microchip USA

USA . 4,019 parts In-Stock

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Corphita

USA . 3,582 parts In-Stock

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DigiPath Technology Company

USA . 1,742 parts In-Stock

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$32.532

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Overview

Looking for a reliable microcontroller for your next project? Look no further than the LM3S1621-IQC80-C5 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and performance in their products. This microcontroller is perfect for a wide range of applications, offering customers exceptional value and benefits. With its advanced features and capabilities, the LM3S1621-IQC80-C5 provides unmatched advantages that will help you take your projects to the next level. Upgrade to Texas Instruments and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good mechanical strength and protection for the microcontroller, making it durable and reliable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto a PCB, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: SQUARE

The square package shape allows for easy orientation and placement of the microcontroller on the PCB, simplifying the design process.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex operations and calculations efficiently, making it suitable for demanding applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows for flexibility in system design and power management, catering to different requirements.

No. of Terminals: 100

Having a high number of terminals provides ample connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's functionality.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile and space-saving design, making it suitable for compact applications where size is a constraint.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and enhances energy efficiency in battery-powered applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions or high-temperature applications.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers excellent performance and energy efficiency, making the microcontroller suitable for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance allows the microcontroller to operate reliably in cold environments or industrial settings with temperature fluctuations.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors and signals, expanding its capabilities for data acquisition and processing.

DMA Channels: YES

Support for DMA channels allows for efficient data transfer and processing without CPU intervention, improving overall system performance and responsiveness.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and secure connections, ensuring reliable electrical contact between the microcontroller and the PCB.

ROM Words: 131072

With a large ROM capacity, the microcontroller can store extensive program code and data, enabling the implementation of complex algorithms and applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for a slim profile and compact design, making the microcontroller suitable for space-constrained applications.

Width: 14 mm

The compact width of the microcontroller enhances PCB layout flexibility and allows for efficient use of space in crowded electronic assemblies.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency allows for fast processing and execution of instructions, making the microcontroller responsive and suitable for time-critical tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum time at peak reflow temperature ensures proper soldering and reflow processes during manufacturing, enhancing product quality and reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures that the microcontroller can withstand the required soldering processes without degradation or damage.

Length: 14 mm

The compact length of the microcontroller facilitates space-efficient PCB designs and integration into small form factor devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments with wide temperature fluctuations and harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller based on RISC architecture, the product offers efficient performance, reduced power consumption, and streamlined instruction execution for embedded applications.

RAM Bytes: 32768

With a large RAM size, the microcontroller can accommodate multiple variables and data buffers, enabling efficient data processing and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and excellent reliability, making the microcontroller suitable for battery-powered and portable devices.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and secure solder joints, ensuring reliable electrical connections and robust performance in various operating conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage specification indicates the standard operating voltage for optimal performance and compatibility with other system components.

PWM Channels: YES

Support for PWM channels enables the microcontroller to generate precise analog output signals, making it suitable for motor control, power management, and analog applications.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and fast firmware updates and modifications, enhancing the flexibility and versatility of the microcontroller for evolving requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch facilitates high-density mounting on the PCB, enabling compact designs and efficient use of space in modern electronics.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates that the microcontroller is suitable for standard moisture-sensitive handling and assembly processes, ensuring product reliability and longevity.

Speed: 80 rpm

Although not directly related to the microcontroller's performance, the specified speed rating may be relevant for applications involving motor control or speed monitoring.

No. of I/O Lines: 67

The high number of I/O lines provides ample connectivity options for interfacing with external devices, sensors, and peripherals, enhancing the microcontroller's versatility and functionality.

Technical Specifications

Microcontrollers LM3S1621-IQC80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1621-IQC80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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