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LM3S1620-EQC25-A2

Texas Instruments

LM3S1620-EQC25-A2 by Texas Instruments

Texas Instruments' LM3S1620-EQC25-A2 microcontroller features 32-bit architecture, 131072 ROM words, and 32768 RAM bytes. Ideal for industrial applications, it operates b/w -40 to 105 °C with a clock frequency of 0.032 MHz. With 52 I/O lines and PWM channels, this CMOS technology-based device is suitable for various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,956 parts In-Stock

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Digiode

USA . 1,859 parts In-Stock

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1,859

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Distributors (Availability)

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One Stop Electronics

USA . 265 parts In-Stock

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$11.000

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265

$11.000

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AZTECH Wire

Italy . 232 parts In-Stock

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$13.621

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232

$13.621

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Parana Technologies

USA . 816 parts In-Stock

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$13.654

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$14.156

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816

$13.654

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$14.156

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DigiPath Technology Company

USA . 1,105 parts In-Stock

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$15.035

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$13.832

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1,105

$15.035

$13.832

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ChromeModa Solutions

Germany . 4,608 parts In-Stock

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$15.342

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$12.580

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4,608

$15.342

$12.580

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IDEA Electronic Components Group

UK . 1,212 parts In-Stock

1+ parts

$15.342

100+ parts

$14.575

1k+ parts

$13.808

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1,212

$15.342

$14.575

$13.808

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Corphita

USA . 4,332 parts In-Stock

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Microchip USA

USA . 349 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S1620-EQC25-A2 microcontroller from Texas Instruments. Designed with precision and quality in mind, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. Whether you're designing smart home devices, industrial automation solutions, or automotive systems, this versatile microcontroller is your key to success. Trust in Texas Instruments to provide you with the tools you need to bring your ideas to life. Experience the value, benefits, and advantages that the LM3S1620-EQC25-A2 has to offer, and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for long-term use.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and increasing production efficiency.

Maximum Supply Voltage: 2.75 V

Provides a safe operating range for the device, ensuring stability and preventing damage from overvoltage.

Package Shape: SQUARE

Square packages are space-efficient and provide a stable mounting platform for the microcontroller.

Bit Size: 32

A 32-bit microcontroller offers higher processing power and performance compared to lower bit sizes.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options, allowing flexibility in design and compatibility with various systems.

No. of Terminals: 100

Sufficient number of terminals for connectivity and interfacing with external devices and components.

Package Style (Meter): FLATPACK

Flatpack package style offers a compact form factor while still providing adequate space for components inside.

Minimum Supply Voltage: 2.25 V

Ensures the microcontroller can operate within a safe voltage range, preventing undervoltage issues.

Maximum Operating Temperature: 105 °C

Withstands high temperatures, suitable for industrial applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature environments, making it versatile for a wide range of applications.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections.

ADC Channels: YES

Integrated ADC allows for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB mounting and soldering, enhancing assembly efficiency.

ROM Words: 131072

Large ROM capacity enables storing a significant amount of program data and instructions for the microcontroller.

Maximum Seated Height: 1.6 mm

Low profile design with a small seated height, suitable for compact system integration and PCB layout.

Width: 14 mm

Compact width dimension for space-constrained designs, ensuring a smaller footprint on the PCB.

Maximum Clock Frequency: 0.032 MHz

Supports high clock frequencies for fast and efficient processing of instructions and data.

Length: 14 mm

Compact length dimension for space-constrained designs, allowing flexibility in layout and placement.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, suitable for rugged applications with temperature variations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller peripheral functionality provide efficient processing and versatile system control capabilities.

RAM Bytes: 32768

Sufficient RAM capacity for data storage and processing, supporting multitasking and sophisticated algorithms.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form allows for easy surface mount soldering and inspection, improving manufacturing yield and reliability.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and reliability under normal operating conditions.

PWM Channels: YES

Integrated PWM channels enable precise control of analog outputs, suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization, enhancing the versatility and longevity of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on PCBs, saving space and enabling compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate moisture sensitivity, suitable for standard surface mount assembly processes.

Speed: 25 rpm

Supports fast processing speed of instructions and data, enabling quick response times for real-time applications.

No. of I/O Lines: 52

Sufficient number of I/O lines for interfacing with external devices, sensors, and peripherals, providing flexibility in system connectivity.

Technical Specifications

Microcontrollers LM3S1620-EQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1620-EQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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