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LM3S1608-IBZ50-A2

Texas Instruments

LM3S1608-IBZ50-A2 by Texas Instruments

Texas Instruments LM3S1608-IBZ50-A2 is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 8.192 MHz, it features 52 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

$19.262

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 258 parts In-Stock

1+ parts

-

100+ parts

$15.410

1k+ parts

$13.790

10k+ parts

$12.980

258

-

$15.410

$13.790

$12.980

DigiKey

USA . 258 parts In-Stock

1+ parts

-

100+ parts

$20.270

1k+ parts

-

10k+ parts

-

258

-

$20.270

-

-

Verical

USA . 258 parts In-Stock

1+ parts

-

100+ parts

$19.262

1k+ parts

$17.238

10k+ parts

$16.225

258

-

$19.262

$17.238

$16.225

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,294 parts In-Stock

1+ parts

$16.274

100+ parts

-

1k+ parts

-

10k+ parts

-

3,294

$16.274

-

-

-

Vyrian

USA . 5,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,600

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 83 parts In-Stock

1+ parts

$14.560

100+ parts

-

1k+ parts

-

10k+ parts

-

83

$14.560

-

-

-

Corphita

USA . 2,618 parts In-Stock

1+ parts

$15.417

100+ parts

-

1k+ parts

-

10k+ parts

-

2,618

$15.417

-

-

-

Component Stockers USA

USA . 251 parts In-Stock

1+ parts

$17.790

100+ parts

$16.720

1k+ parts

-

10k+ parts

-

251

$17.790

$16.720

-

-

Parana Technologies

USA . 1,881 parts In-Stock

1+ parts

$42.476

100+ parts

-

1k+ parts

-

10k+ parts

-

1,881

$42.476

-

-

-

ChromeModa Solutions

Germany . 6,070 parts In-Stock

1+ parts

$47.726

100+ parts

$39.135

1k+ parts

-

10k+ parts

-

6,070

$47.726

$39.135

-

-

IDEA Electronic Components Group

UK . 2,140 parts In-Stock

1+ parts

$47.726

100+ parts

$45.340

1k+ parts

$42.953

10k+ parts

-

2,140

$47.726

$45.340

$42.953

-

Microchip USA

USA . 1,641 parts In-Stock

1+ parts

$53.270

100+ parts

$52.340

1k+ parts

$51.880

10k+ parts

$51.410

1,641

$53.270

$52.340

$51.880

$51.410

DigiPath Technology Company

USA . 456 parts In-Stock

1+ parts

-

100+ parts

$43.030

1k+ parts

-

10k+ parts

-

456

-

$43.030

-

-

Kepictronics

USA . 258 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

258

-

-

-

-

Overview

Unleash the power of innovation with the LM3S1608-IBZ50-A2 microcontroller from Texas Instruments. Known for their top-notch quality and cutting-edge technology, Texas Instruments delivers a product that exceeds expectations. This versatile microcontroller is perfect for a wide range of applications, making it ideal for any project. With its impressive features and reliable performance, this microcontroller offers unbeatable value and benefits to customers looking to take their designs to the next level. Upgrade your projects with the LM3S1608-IBZ50-A2 and experience the difference Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and convenient assembly onto PCBs, saving time and effort in the production process.

Maximum Supply Voltage: 2.75 V

This voltage limit ensures safe operation and protects the microcontroller from potential damage caused by excessive voltage.

Package Shape: SQUARE

The square shape of the package offers a compact design, saving space on the PCB and enabling efficient layout.

Bit Size: 32

The 32-bit architecture of the microcontroller allows for handling larger data sizes and more complex calculations, improving overall performance.

Power Supplies (V): 2.5,3.3

Support for multiple power supply options provides flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 108

Having a high number of terminals offers connectivity options for a wide range of peripherals and interfaces, enhancing the microcontroller's versatility.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates a reliable connection to the PCB, ensuring stable performance in different environmental conditions.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage specification guarantees proper functioning even under low-power conditions, maintaining stable operation.

Maximum Operating Temperature: 85 °C

With a high operating temperature limit, the microcontroller can withstand harsh environmental conditions and operate reliably in industrial settings.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes the microcontroller suitable for use in various applications, including automotive and outdoor devices.

Terminal Finish: TIN SILVER COPPER

This terminal finish ensures good conductivity and corrosion resistance, contributing to the long-term reliability of the microcontroller.

ADC Channels: YES

The analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its capabilities in data acquisition.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and routing, making it easier to integrate the microcontroller into compact designs.

ROM Words: 131072

The large ROM capacity allows for storing a significant amount of program code and data, accommodating complex applications and algorithms.

Maximum Seated Height: 1.5 mm

The low seated height facilitates a slim profile for the microcontroller, ideal for space-constrained applications and slim devices.

Width: 10 mm

The compact width of the microcontroller contributes to efficient PCB layout and integration, reducing overall system footprint.

Maximum Clock Frequency: 8.192 MHz

The high clock frequency capability supports fast processing speeds, enabling quick response times and efficient execution of tasks.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures appropriate exposure time during reflow soldering processes, preventing damage to the microcontroller due to overheating.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes the microcontroller robust during soldering processes, ensuring reliability and solder joint integrity.

Length: 10 mm

The compact length of the microcontroller contributes to space-saving designs, enhancing flexibility in product development and integration.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature environments, this microcontroller offers reliable performance in rugged conditions and extended operational lifetimes.

Peripheral IC Type: MICROCONTROLLER, RISC

Featuring a RISC architecture, the microcontroller delivers efficient processing power and optimized performance for a wide range of applications.

RAM Bytes: 32768

With a generous RAM capacity, the microcontroller can handle multiple tasks simultaneously, storing and manipulating data efficiently.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the microcontroller.

Terminal Form: BALL

The ball terminal form offers reliable connections and facilitates soldering processes, ensuring secure attachment to the PCB for stable operation.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage specification defines the standard operating voltage, ensuring compatibility with common power sources and system requirements.

PWM Channels: YES

Support for pulse-width modulation channels enables precise control of connected devices and peripherals, offering flexibility in application design.

ROM Programmability: FLASH

The flash programmable ROM allows for easy updating and modification of the microcontroller's firmware, facilitating software development and maintenance.

Terminal Pitch: 0.8 mm

The narrow terminal pitch contributes to high-density PCB layouts and compact designs, optimizing space utilization and integration efficiency.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate sensitivity to moisture during storage and handling, requiring standard precautions for proper device handling.

Speed: 50 rpm

The 50 rpm speed specification may refer to the GPIO toggle speed or another specific operation speed of the microcontroller, affecting its performance in certain tasks or applications.

No. of I/O Lines: 52

A high number of I/O lines offer extensive connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's versatility and functionality.

Technical Specifications

Microcontrollers LM3S1608-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1608-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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