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LM3S1601-IBZ50-A2T

Texas Instruments

LM3S1601-IBZ50-A2T by Texas Instruments

LM3S1601-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, making it suitable for industrial applications requiring high-speed processing and control capabilities. With 60 I/O lines and PWM channels, this microcontroller offers versatile connectivity options for various electronic systems.

Median Price

$23.120

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 54 parts In-Stock

1+ parts

$23.120

100+ parts

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54

$23.120

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Vyrian

USA . 4,130 parts In-Stock

1+ parts

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4,130

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Digiode

USA . 3,406 parts In-Stock

1+ parts

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3,406

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 573 parts In-Stock

1+ parts

$9.000

100+ parts

-

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573

$9.000

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AZTECH Wire

Italy . 731 parts In-Stock

1+ parts

$14.695

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731

$14.695

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$17.259

100+ parts

$15.706

1k+ parts

$14.152

10k+ parts

-

1,000

$17.259

$15.706

$14.152

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Parana Technologies

USA . 325 parts In-Stock

1+ parts

$40.289

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325

$40.289

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ChromeModa Solutions

Germany . 6,552 parts In-Stock

1+ parts

$45.268

100+ parts

$37.120

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6,552

$45.268

$37.120

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IDEA Electronic Components Group

UK . 823 parts In-Stock

1+ parts

$45.268

100+ parts

$43.005

1k+ parts

$40.741

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823

$45.268

$43.005

$40.741

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Microchip USA

USA . 2,547 parts In-Stock

1+ parts

$46.530

100+ parts

$45.720

1k+ parts

$45.320

10k+ parts

$44.910

2,547

$46.530

$45.720

$45.320

$44.910

Corphita

USA . 2,785 parts In-Stock

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2,785

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DigiPath Technology Company

USA . 1,398 parts In-Stock

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$40.814

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1,398

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$40.814

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Overview

Unleash the power of innovation with the LM3S1601-IBZ50-A2T microcontroller by Texas Instruments. Crafted with precision and expertise, this device is designed to revolutionize your projects with its advanced features and reliable performance. Perfect for a wide range of applications, this microcontroller offers unparalleled value and benefits to customers seeking cutting-edge technology. Elevate your designs with the LM3S1601-IBZ50-A2T and experience the difference of quality engineering from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Ease of assembly and compatibility with modern PCB manufacturing processes.

Maximum Supply Voltage: 2.75 V

Efficient power consumption and compatibility with low voltage applications.

Package Shape: SQUARE

Saves space on the PCB and allows for more efficient placement of components.

Bit Size: 32

Higher bit size allows for faster processing and more complex operations.

Power Supplies (V): 2.5,3.3

Compatibility with common power supply voltages in electronic devices.

No. of Terminals: 108

Sufficient number of terminals for connecting to multiple components and peripherals.

Package Style (Meter): GRID ARRAY

Grid array package style provides better thermal performance and reliability.

Minimum Supply Voltage: 2.25 V

Ensures reliability even at lower supply voltages.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where high temperatures may be a factor.

Minimum Operating Temperature: -40 °C

Operational in extreme cold environments without performance issues.

Terminal Finish: TIN SILVER COPPER

Provides a reliable and durable finish for the terminals, ensuring good electrical connections.

ADC Channels: YES

Ability to convert analog signals to digital data for processing.

Terminal Position: BOTTOM

Facilitates easy placement and soldering of the microcontroller on the PCB.

ROM Words: 131072

Large ROM capacity allows for storing significant amounts of program data.

Maximum Seated Height: 1.5 mm

Low profile design for space-constrained applications.

Width: 10 mm

Compact size for integration into small electronic devices.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast processing speeds.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during assembly process.

Peak Reflow Temperature °C: 260

Compatibility with standard reflow soldering processes.

Length: 10 mm

Compact size for integration into small electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for rugged industrial environments with varying temperatures.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and fast data processing.

RAM Bytes: 32768

Sufficient RAM capacity for storing and accessing data during program execution.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for easy soldering and reliable connections.

Nominal Supply Voltage: 2.5 V

Stable and reliable supply voltage for consistent performance.

PWM Channels: YES

Ability to generate Pulse Width Modulation signals for precision control.

ROM Programmability: FLASH

Flash memory for fast and easy reprogramming of the ROM data.

Terminal Pitch: 0.8 mm

Close terminal pitch for compact PCB layout and space savings.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates it can withstand standard moisture exposure levels during storage and assembly.

Speed: 50 rpm

Processing speed of 50 revolutions per minute for efficient data processing.

No. of I/O Lines: 60

Sufficient number of Input/Output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1601-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1601-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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