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LM3S1601-IBZ50-A2

Texas Instruments

LM3S1601-IBZ50-A2 by Texas Instruments

LM3S1601-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a package style of GRID ARRAY and terminal finish of TIN SILVER COPPER, it offers versatile connectivity options for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,793 parts In-Stock

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4,793

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Digiode

USA . 2,702 parts In-Stock

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2,702

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 738 parts In-Stock

1+ parts

$7.951

100+ parts

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738

$7.951

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One Stop Electronics

USA . 327 parts In-Stock

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$27.000

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327

$27.000

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Parana Technologies

USA . 1,623 parts In-Stock

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$51.613

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1,623

$51.613

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Microchip USA

USA . 2,328 parts In-Stock

1+ parts

$53.040

100+ parts

$52.120

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$51.660

10k+ parts

$51.200

2,328

$53.040

$52.120

$51.660

$51.200

DigiPath Technology Company

USA . 1,001 parts In-Stock

1+ parts

$56.832

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1,001

$56.832

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IDEA Electronic Components Group

UK . 754 parts In-Stock

1+ parts

$57.992

100+ parts

$55.092

1k+ parts

$52.193

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754

$57.992

$55.092

$52.193

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ChromeModa Solutions

Germany . 505 parts In-Stock

1+ parts

$57.992

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$47.553

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505

$57.992

$47.553

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Corphita

USA . 547 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S1601-IBZ50-A2 microcontroller from Texas Instruments. Renowned for their superior quality and innovation, Texas Instruments delivers cutting-edge technology that revolutionizes the industry. This microcontroller is perfect for a wide range of applications, offering unmatched performance and efficiency. Say hello to seamless integration, enhanced functionality, and unparalleled reliability with the LM3S1601-IBZ50-A2. Elevate your projects to new heights with this game-changing device.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration in electronic circuits.

Maximum Supply Voltage: 2.75 V

This voltage range ensures safe operation and compatibility with a variety of power sources.

Package Shape: SQUARE

The square shape allows for efficient use of space on electronic boards.

Bit Size: 32

The 32-bit size provides high processing power and capabilities for the microcontroller.

Power Supplies (V): 2.5,3.3

Having multiple power supply options enhances flexibility and compatibility in different systems.

No. of Terminals: 108

Having a high number of terminals enables connectivity with a wide range of peripherals and devices.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and mechanical strength for the microcontroller.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the microcontroller to function in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the microcontroller can operate in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

The presence of analog-to-digital converter channels allows for interfacing with analog sensors and signals.

Terminal Position: BOTTOM

The bottom terminal position simplifies board layout and improves signal routing efficiency.

ROM Words: 131072

With a large ROM capacity, the microcontroller can store complex programs and data for advanced applications.

Maximum Seated Height: 1.5 mm

The low seated height enables compact designs and facilitates integration in space-constrained applications.

Width: 10 mm

The compact width allows for dense packing of components on PCBs, saving space and reducing manufacturing costs.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency enables fast processing and execution of instructions by the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand peak reflow temperature for a sufficient duration during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the microcontroller's reliability during soldering processes.

Length: 10 mm

The compact length facilitates efficient placement and routing on PCBs, contributing to overall system miniaturization.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides efficient processing and execution of instructions for optimal performance.

RAM Bytes: 32768

The microcontroller's large RAM capacity enables temporary data storage for complex algorithms and calculations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form allows for reliable solder connections and efficient heat dissipation.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage ensures stable operation and compatibility with standard power sources.

PWM Channels: YES

The presence of pulse-width modulation channels enables precise control over motor speeds and other applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy reprogramming of the microcontroller without the need for special equipment.

Terminal Pitch: 0.8 mm

The small terminal pitch facilitates high-density mounting and efficient use of PCB real estate.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the microcontroller's resistance to moisture and ensures reliable operation in various environments.

Speed: 50 rpm

The high speed rating allows the microcontroller to process tasks quickly and efficiently in time-sensitive applications.

No. of I/O Lines: 60

The high number of I/O lines enables versatile connectivity and interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1601-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1601-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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