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LM3S1601-EQC50-A2

Texas Instruments

LM3S1601-EQC50-A2 by Texas Instruments

LM3S1601-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring PWM channels and ADC channels. With a package style of FLATPACK and GULL WING terminal form, it offers 60 I/O lines in a compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,950 parts In-Stock

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Digiode

USA . 517 parts In-Stock

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517

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Distributors (Availability)

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AZTECH Wire

Italy . 261 parts In-Stock

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$19.796

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261

$19.796

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One Stop Electronics

USA . 1,249 parts In-Stock

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$33.000

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$33.000

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Parana Technologies

USA . 1,105 parts In-Stock

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$48.160

100+ parts

$4,472.357

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$43.344

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1,105

$48.160

$4,472.357

$43.344

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DigiPath Technology Company

USA . 1,522 parts In-Stock

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$53.030

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1,522

$53.030

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ChromeModa Solutions

Germany . 4,427 parts In-Stock

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$54.112

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$44.372

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4,427

$54.112

$44.372

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IDEA Electronic Components Group

UK . 2,320 parts In-Stock

1+ parts

$54.112

100+ parts

$51.406

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$48.701

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2,320

$54.112

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$48.701

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Corphita

USA . 498 parts In-Stock

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Microchip USA

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Overview

Unleash the power of innovation with the Texas Instruments LM3S1601-EQC50-A2 microcontroller. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance and reliability in a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers exceptional value and benefits to customers seeking top-notch quality and advanced features. Elevate your projects to new heights with the LM3S1601-EQC50-A2 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Ease of installation and compatibility with modern PCB designs.

Maximum Supply Voltage: 2.75 V

Allows for efficient power consumption and prevents overvoltage issues.

Bit Size: 32

Higher bit size allows for more complex operations and calculations to be performed.

Power Supplies (V): 2.5,3.3

Versatile power supply options for flexibility in different applications.

No. of Terminals: 100

Sufficient number of terminals for connectivity and interfacing with other components.

Package Style (Meter): FLATPACK

Space-efficient design for compact electronic devices.

Minimum Supply Voltage: 2.25 V

Ensures stable operation even at lower voltage levels.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications that may require higher operating temperatures.

Minimum Operating Temperature: -40 °C

Can withstand and operate in extreme cold environments.

Terminal Finish: TIN

Provides good electrical conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to process analog signals.

ROM Words: 131072

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low-profile design for space-constrained applications.

Width: 14 mm

Compact form factor for integration into small electronic devices.

Maximum Clock Frequency: 0.032 MHz

High clock frequency allows for fast processing and response times.

Length: 14 mm

Compact form factor for space-efficient PCB layout.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and high-performance computing.

RAM Bytes: 32768

Sufficient RAM capacity for temporary data storage and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for easy soldering and connection.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent performance.

PWM Channels: YES

Pulse-width modulation support for precise control of output signals.

ROM Programmability: FLASH

Flash programmable ROM for easy and flexible program updates.

Terminal Pitch: 0.5 mm

Fine pitch for compact and high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for standard handling and storage procedures.

Speed: 50 rpm

Operates at a moderate speed suitable for various applications.

No. of I/O Lines: 60

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1601-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1601-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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