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LM3S1538-IQC50-A2T

Texas Instruments

LM3S1538-IQC50-A2T by Texas Instruments

Texas Instruments' LM3S1538-IQC50-A2T is a 32-bit microcontroller with 98304 ROM words and 65536 RAM bytes. Operating at up to 0.032 MHz, it offers 43 I/O lines and PWM channels for industrial applications requiring a temperature range of -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 10,900 parts In-Stock

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Vyrian

USA . 6,018 parts In-Stock

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6,018

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Digiode

USA . 1,570 parts In-Stock

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1,570

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 469 parts In-Stock

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$13.000

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469

$13.000

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AZTECH Wire

Italy . 692 parts In-Stock

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$16.480

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692

$16.480

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$27.735

100+ parts

$25.239

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$22.743

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1,000

$27.735

$25.239

$22.743

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Parana Technologies

USA . 1,551 parts In-Stock

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$28.137

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$44.111

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1,551

$28.137

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$44.111

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DigiPath Technology Company

USA . 2,322 parts In-Stock

1+ parts

$30.983

100+ parts

$28.504

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2,322

$30.983

$28.504

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ChromeModa Solutions

Germany . 3,589 parts In-Stock

1+ parts

$31.615

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$25.924

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$31.615

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IDEA Electronic Components Group

UK . 725 parts In-Stock

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$31.615

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$30.034

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$28.454

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725

$31.615

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$28.454

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Microchip USA

USA . 2,938 parts In-Stock

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$44.010

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$43.380

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$43.070

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$42.750

2,938

$44.010

$43.380

$43.070

$42.750

Corphita

USA . 2,813 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S1538-IQC50-A2T by Texas Instruments. Crafted with precision and expertise, this microcontroller is designed to empower your projects with seamless performance. From industrial automation to consumer electronics, this versatile device offers unparalleled value and efficiency. With advanced features and reliable technology, this powerful microcontroller is sure to elevate your creations to new heights. Trust in Texas Instruments for quality and innovation that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capabilities allow for easy installation and space-saving on circuit boards.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a safe voltage range to prevent damage to the microcontroller.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board.

Bit Size: 32

Higher bit size allows for more complex operations and calculations.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options for flexibility in different applications.

No. of Terminals: 100

Sufficient number of terminals for connectivity and integration with other components.

Package Style (Meter): FLATPACK

Flatpack style enhances heat dissipation and allows for easy mounting on the circuit board.

Minimum Supply Voltage: 2.25 V

Ensures the microcontroller operates reliably even at low voltages.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates effectively even in very low temperature conditions.

Terminal Finish: TIN

Tin finish provides good conductivity and protection against corrosion.

ADC Channels: YES

Analog-to-digital converter channels allow for interfacing with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and connection on the circuit board.

ROM Words: 98304

Large ROM capacity allows for storing extensive program codes and data.

Maximum Seated Height: 1.6 mm

Low seated height enables compact design and space-efficient placement on the circuit board.

Width: 14 mm

Compact width allows for efficient use of space on the circuit board.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency enables fast processing speeds and real-time operations.

Maximum Time At Peak Reflow Temperature (s): 30

Can sustain peak reflow temperature for a specified duration without damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable operation in various manufacturing processes.

Length: 14 mm

Compact length allows for efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments and temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing and control capabilities for the microcontroller.

RAM Bytes: 65536

Large RAM capacity allows for efficient data storage and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and connection on the circuit board.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

Pulse width modulation channels enable precise control of connected devices and components.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility for updating firmware and software applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the circuit board.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level ensures safe handling and storage in humid environments.

Speed: 50 rpm

Operates at a speed of 50 revolutions per minute, suitable for various control and feedback applications.

No. of I/O Lines: 43

Sufficient number of input/output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1538-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

43

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1538-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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