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LM3S1512-EQC25-A2

Texas Instruments

LM3S1512-EQC25-A2 by Texas Instruments

LM3S1512-EQC25-A2 by Texas Instruments is a 32-bit microcontroller with 98304 ROM words and 65536 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it offers 58 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control. With a temperature range from -40 to 105 °C, this CMOS technology-based microcontroller is suitable for various embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,821 parts In-Stock

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Digiode

USA . 1,311 parts In-Stock

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1,311

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Distributors (Availability)

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One Stop Electronics

USA . 867 parts In-Stock

1+ parts

$5.000

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867

$5.000

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AZTECH Wire

Italy . 266 parts In-Stock

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$13.976

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266

$13.976

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Parana Technologies

USA . 1,719 parts In-Stock

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$52.840

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$52.840

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DigiPath Technology Company

USA . 1,609 parts In-Stock

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$58.184

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1,609

$58.184

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IDEA Electronic Components Group

UK . 2,299 parts In-Stock

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$59.371

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$56.402

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$53.434

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2,299

$59.371

$56.402

$53.434

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ChromeModa Solutions

Germany . 1,485 parts In-Stock

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$59.371

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$48.684

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1,485

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Corphita

USA . 2,908 parts In-Stock

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Microchip USA

USA . 195 parts In-Stock

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Overview

Unlock limitless possibilities with the LM3S1512-EQC25-A2 by Texas Instruments, a cutting-edge microcontroller that offers unparalleled quality and reliability. Manufactured by a trusted industry leader, this innovative device is perfect for a wide range of applications in various industries. Experience seamless performance and efficiency with its advanced features and functionalities. Trust in Texas Instruments to deliver top-of-the-line products that exceed your expectations. Elevate your projects with the LM3S1512-EQC25-A2 and discover a world of endless opportunities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and reliability for the microcontroller package.

Surface Mount: YES

Allows for easy and efficient PCB assembly process.

Maximum Supply Voltage: 2.75 V

Optimal voltage supply for stable performance of the microcontroller.

Package Shape: SQUARE

Square shape helps in efficient space utilization on the PCB.

Bit Size: 32

Allows for handling of complex computational tasks effectively.

Power Supplies (V): 2.5,3.3

Offers flexibility in power supply options for different applications.

No. of Terminals: 100

Sufficient number of terminals for connecting to various external components.

Package Style (Meter): FLATPACK

Flatpack style provides a compact and slim profile for space-constrained designs.

Minimum Supply Voltage: 2.25 V

Ensures reliable operation even at lower supply voltages.

Maximum Operating Temperature: 105 °C

Can operate effectively at high temperatures, suitable for industrial use.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments as well.

Terminal Finish: TIN

Tin finish provides good electrical conductivity and corrosion resistance.

ADC Channels: YES

Integrated Analog-to-Digital Converter (ADC) channels for analog signal processing.

Terminal Position: QUAD

Quad terminal configuration for easy soldering and connection.

ROM Words: 98304

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact and slim electronic devices.

Width: 14 mm

Moderate width size for fitting into standard PCB layouts.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast and responsive performance.

Length: 14 mm

Compact length size for space-efficient designs.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environment conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing and control capabilities.

RAM Bytes: 65536

Generous RAM capacity for temporary data storage and processing.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for easy surface mounting on the PCB.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

Pulse Width Modulation (PWM) channels for precise control of outputs.

ROM Programmability: FLASH

Flash programmable ROM for easy firmware updates and modifications.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layouts and connections.

Moisture Sensitivity Level (MSL): 3

MSL rating of 3 indicates moderate sensitivity to moisture, suitable for controlled environments.

Speed: 25 rpm

Operates at a speed of 25 rotations per minute for controlling external devices.

No. of I/O Lines: 58

Sufficient number of Input/Output lines for interfacing with external peripherals and sensors.

Technical Specifications

Microcontrollers LM3S1512-EQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

58

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1512-EQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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