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LM3S1439-IQC50-A2

Texas Instruments

LM3S1439-IQC50-A2 by Texas Instruments

Texas Instruments LM3S1439-IQC50-A2 microcontroller features 32-bit CPU, 32768 bytes RAM, and 98304 ROM words. Ideal for industrial applications with peripherals like PWM(6), QEI(2), TIMER(3), WDT, and connectivity options such as I2C, SSI(2), UART(2). Operates at -40 to 85°C temperature range.

Median Price

$21.900

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$21.900

1k+ parts

$19.590

10k+ parts

$18.440

6

-

$21.900

$19.590

$18.440

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 117 parts In-Stock

1+ parts

$23.114

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-

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117

$23.114

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Vyrian

USA . 3,075 parts In-Stock

1+ parts

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3,075

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DigiKey Marketplace

USA . 270 parts In-Stock

1+ parts

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270

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Distributors (Availability)

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AZTECH Wire

Italy . 1,093 parts In-Stock

1+ parts

$19.690

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-

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1,093

$19.690

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Corphita

USA . 1,107 parts In-Stock

1+ parts

$21.897

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1,107

$21.897

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Microchip USA

USA . 363 parts In-Stock

1+ parts

$64.290

100+ parts

$63.180

1k+ parts

$62.620

10k+ parts

$62.060

363

$64.290

$63.180

$62.620

$62.060

Parana Technologies

USA . 2,209 parts In-Stock

1+ parts

$65.599

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2,209

$65.599

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DigiPath Technology Company

USA . 2,123 parts In-Stock

1+ parts

$72.233

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2,123

$72.233

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ChromeModa Solutions

Germany . 3,202 parts In-Stock

1+ parts

$73.707

100+ parts

$60.440

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3,202

$73.707

$60.440

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IDEA Electronic Components Group

UK . 2,324 parts In-Stock

1+ parts

$73.707

100+ parts

$70.022

1k+ parts

$66.336

10k+ parts

-

2,324

$73.707

$70.022

$66.336

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

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6,000

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Overview

Unlock the power of innovation with the LM3S1439-IQC50-A2 by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers cutting-edge solutions for a wide range of applications. With integrated cache and a robust set of peripherals, this microcontroller offers exceptional performance and efficiency. Whether you're working on industrial automation or IoT projects, the LM3S1439-IQC50-A2 provides the reliability and versatility you need to bring your ideas to life. Trust Texas Instruments to deliver quality and value in every product they create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a durable and cost-effective material for packaging, ensuring reliability and affordability for the product.

Integrated Cache: YES

Integrated cache helps in improving the speed and efficiency of the microcontroller operations by storing frequently used data closer to the CPU.

Maximum Supply Voltage: 2.75 V

Operating within a maximum supply voltage of 2.75V makes this microcontroller suitable for low power applications where energy efficiency is crucial.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle larger numbers and perform more complex calculations, making it suitable for advanced applications.

CPU Family: CORTEX-M3

Being part of the CORTEX-M3 CPU family ensures high performance and compatibility with industry-standard ARM Cortex architecture.

ADC Channels: YES

Having Analog to Digital Converters (ADC) channels allows the microcontroller to interface with analog sensors and devices, increasing its versatility.

Peripheral IC Type: MICROCONTROLLER, RISC

This microcontroller utilizes Reduced Instruction Set Computing (RISC) architecture, which typically results in faster execution of instructions, making it suitable for real-time applications.

No. of Timers: 3

Having multiple timers enables precise timing control for various functions and tasks, enhancing the microcontroller's capability for time-sensitive operations.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital and analog circuits.

PWM Channels: YES

Pulse Width Modulation (PWM) channels allow for precise control of output signals, making this microcontroller suitable for applications requiring accurate modulation and control.

Technical Specifications

Microcontrollers LM3S1439-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

52

No. of Serial I/Os:

5

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI(2), UART(2)

Peripherals:

PWM(6), QEI(2), TIMER(3), WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

LM3S1439-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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