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LM3S1439-IBZ50-A2T

Texas Instruments

LM3S1439-IBZ50-A2T by Texas Instruments

LM3S1439-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 32768 bytes of RAM and 98304 ROM words. It operates at a max clock frequency of 8.192 MHz, making it suitable for industrial applications requiring high-speed processing and control capabilities. With a package style of GRID ARRAY and terminal finish of TIN SILVER COPPER, this microcontroller offers versatile connectivity options for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,192 parts In-Stock

1+ parts

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7,192

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Digiode

USA . 3,645 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,645

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,174 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

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10k+ parts

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1,174

$5.000

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AZTECH Wire

Italy . 630 parts In-Stock

1+ parts

$16.241

100+ parts

-

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630

$16.241

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Microchip USA

USA . 3,306 parts In-Stock

1+ parts

$44.980

100+ parts

$44.340

1k+ parts

$44.010

10k+ parts

$43.690

3,306

$44.980

$44.340

$44.010

$43.690

Parana Technologies

USA . 1,495 parts In-Stock

1+ parts

$57.491

100+ parts

-

1k+ parts

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1,495

$57.491

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ChromeModa Solutions

Germany . 3,490 parts In-Stock

1+ parts

$64.597

100+ parts

$52.970

1k+ parts

-

10k+ parts

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3,490

$64.597

$52.970

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IDEA Electronic Components Group

UK . 1,011 parts In-Stock

1+ parts

$64.597

100+ parts

$61.367

1k+ parts

$58.137

10k+ parts

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1,011

$64.597

$61.367

$58.137

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Component Stockers USA

USA . 545 parts In-Stock

1+ parts

$99.990

100+ parts

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545

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 4,072 parts In-Stock

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4,072

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DigiPath Technology Company

USA . 1,197 parts In-Stock

1+ parts

-

100+ parts

$58.241

1k+ parts

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1,197

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$58.241

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Corphita

USA . 1,137 parts In-Stock

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1,137

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Overview

Unlock the power of innovation with the LM3S1439-IBZ50-A2T microcontroller by Texas Instruments. Crafted with precision and expertise, this high-quality device offers unmatched performance and reliability. Ideal for a wide range of applications, this microcontroller provides customers with unparalleled value and benefits. From industrial automation to consumer electronics, this product delivers cutting-edge technology and efficiency like never before. Upgrade your projects with the LM3S1439-IBZ50-A2T and experience superior performance that sets you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V ensures safe operation and protection of the microcontroller from overvoltage conditions.

Package Shape: SQUARE

The square package shape provides a compact form factor, ideal for applications where space is limited.

Bit Size: 32

A bit size of 32 ensures high processing power and capability, suitable for handling complex tasks and computations.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) allows flexibility in design and compatibility with different systems.

No. of Terminals: 108

With 108 terminals, this microcontroller offers ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style provides secure mechanical connections and efficient heat dissipation, enhancing the reliability and performance of the microcontroller.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25V ensures stable operation even under low power conditions, increasing the versatility of the microcontroller.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can withstand harsh environmental conditions and thermal stress.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance even in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper as terminal finishes provides excellent conductivity and corrosion resistance, ensuring long-term operational reliability.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals into digital data, enabling accurate and precise measurements.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure mounting onto the circuit board, ensuring a stable connection and efficient signal transmission.

ROM Words: 98304

With a ROM size of 98304 words, this microcontroller can store a large amount of program code and data, enabling complex functionalities and applications.

Maximum Seated Height: 1.5 mm

The low maximum seated height of 1.5mm allows for a slim profile and space-saving design, ideal for applications with tight constraints.

Width: 10 mm

The compact width of 10mm makes this microcontroller suitable for small form factor devices and applications where space is limited.

Maximum Clock Frequency: 8.192 MHz

With a maximum clock frequency of 8.192MHz, this microcontroller offers high-speed processing capabilities, suitable for real-time applications and tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand a peak reflow temperature for up to 30 seconds ensures reliable soldering and assembly processes during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for secure and efficient soldering of the microcontroller onto the PCB, ensuring robust connections.

Length: 10 mm

The short length of 10mm contributes to the compact size and space-efficient design of this microcontroller, making it suitable for a wide range of applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making this microcontroller suitable for industrial automation and control applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture offers high performance, low power consumption, and efficient execution of instructions, making it ideal for embedded systems and applications.

RAM Bytes: 32768

With a RAM size of 32768 bytes, this microcontroller can store and process a large amount of data, enabling multitasking and efficient operation of algorithms.

Technology: CMOS

The use of CMOS technology in this microcontroller ensures low power consumption, high speed, and reliable operation, making it ideal for battery-powered devices and energy-efficient applications.

Terminal Form: BALL

The ball terminal form provides secure solder connections and easy mounting onto the PCB, ensuring reliable electrical connections and stable performance.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V ensures stable and efficient operation of the microcontroller, meeting the power requirements of various applications.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog signals, enabling pulse-width modulation for applications such as motor control, lighting, and audio processing.

ROM Programmability: FLASH

The use of flash memory for ROM programmability allows for easy and fast reprogramming of the microcontroller, facilitating firmware updates and customization.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm enables high-density mounting and compact layout designs, suitable for miniaturized electronic devices and applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the handling and storage requirements for the microcontroller, ensuring proper precautions are taken to prevent moisture-related damage.

Speed: 50 rpm

With a speed rating of 50rpm, this microcontroller offers high-speed processing capabilities, suitable for applications requiring rapid data acquisition and computation.

No. of I/O Lines: 52

With 52 I/O lines, this microcontroller provides ample input and output options for connecting to external devices, sensors, and communication interfaces, enhancing its versatility and connectivity.

Technical Specifications

Microcontrollers LM3S1439-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1439-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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