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LM3S1435-IBZ50-A2

Texas Instruments

LM3S1435-IBZ50-A2 by Texas Instruments

LM3S1435-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at up to 8.192 MHz. It features 32768 bytes of RAM, FLASH ROM programmability, and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,391 parts In-Stock

1+ parts

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4,391

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Digiode

USA . 2,514 parts In-Stock

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2,514

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Distributors (Availability)

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AZTECH Wire

Italy . 346 parts In-Stock

1+ parts

$9.966

100+ parts

-

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346

$9.966

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One Stop Electronics

USA . 1,290 parts In-Stock

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$14.000

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-

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1,290

$14.000

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Parana Technologies

USA . 1,972 parts In-Stock

1+ parts

$23.431

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$24.065

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1,972

$23.431

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$24.065

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DigiPath Technology Company

USA . 2,201 parts In-Stock

1+ parts

$25.800

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2,201

$25.800

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ChromeModa Solutions

Germany . 4,147 parts In-Stock

1+ parts

$26.327

100+ parts

$21.588

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4,147

$26.327

$21.588

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IDEA Electronic Components Group

UK . 502 parts In-Stock

1+ parts

$26.327

100+ parts

$25.011

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$23.694

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502

$26.327

$25.011

$23.694

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Microchip USA

USA . 1,153 parts In-Stock

1+ parts

$45.470

100+ parts

$44.820

1k+ parts

$44.500

10k+ parts

$44.170

1,153

$45.470

$44.820

$44.500

$44.170

Corphita

USA . 740 parts In-Stock

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740

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Overview

Discover the Texas Instruments LM3S1435-IBZ50-A2 microcontroller, a versatile and reliable solution for your electronic projects. With a reputation for excellence, Texas Instruments delivers top-notch quality and performance in every product. Ideal for a wide range of applications, this microcontroller offers seamless integration, efficiency, and reliability. Unlock endless possibilities with the LM3S1435-IBZ50-A2 and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient integration on circuit boards.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications, saving energy and reducing heat generation.

Package Shape: SQUARE

Allows for efficient use of space on the circuit board.

Bit Size: 32

Offers high computational capabilities for running complex algorithms and processes.

Power Supplies (V): 2.5,3.3

Provides flexibility in powering the microcontroller according to specific requirements.

No. of Terminals: 108

Offers a wide range of connections for various peripherals and components.

Package Style (Meter): GRID ARRAY

Ensures secure and reliable connections on the circuit board.

Minimum Supply Voltage: 2.25 V

Allows for operation even in low voltage conditions, enhancing versatility.

Maximum Operating Temperature: 85 °C

Capable of functioning in high temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates effectively in cold environments, increasing its adaptability to various conditions.

Terminal Finish: TIN SILVER COPPER

Ensures strong and reliable connections for stability and performance.

ADC Channels: YES

Allows for analog to digital conversion, essential for interfacing with sensors and other analog devices.

Terminal Position: BOTTOM

Facilitates easier placement and soldering on the circuit board.

ROM Words: 98304

Offers ample storage capacity for program instructions and data.

Maximum Seated Height: 1.5 mm

Compact size makes it suitable for applications with space constraints.

Width: 10 mm

Compact dimensions enable integration in small form factor devices.

Maximum Clock Frequency: 8.192 MHz

Provides high processing speed for swift execution of commands and operations.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly for reliable connections.

Peak Reflow Temperature °C: 260

Withstands high temperatures during soldering process, ensuring durability.

Length: 10 mm

Compact dimensions allow for space-efficient placement on the circuit board.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient and high-performance computing.

RAM Bytes: 32768

Ample random access memory for storing and processing data during operation.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminals provide secure connections and improve reliability.

Nominal Supply Voltage: 2.5 V

Optimal voltage for stable and efficient operation of the microcontroller.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of motors and other components.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware.

Terminal Pitch: 0.8 mm

Fine pitch terminals enable high density mounting on the circuit board.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture levels during storage and operation.

Speed: 50 rpm

Suitable for applications requiring precise speed control, such as motor control.

No. of I/O Lines: 46

Offers a sufficient number of input/output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1435-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1435-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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