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LM3S1435-EQC50-A2T

Texas Instruments

LM3S1435-EQC50-A2T by Texas Instruments

LM3S1435-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 32768 bytes of RAM and 98304 ROM words. It operates at a max clock frequency of 8.192 MHz, suitable for industrial applications requiring a wide temperature range from -40 to 105°C. With PWM channels and ADC capabilities, it offers versatile I/O options in a compact flatpack package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,941 parts In-Stock

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4,941

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Vyrian

USA . 4,667 parts In-Stock

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4,667

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,379 parts In-Stock

1+ parts

$4.000

100+ parts

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1,379

$4.000

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AZTECH Wire

Italy . 821 parts In-Stock

1+ parts

$16.569

100+ parts

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821

$16.569

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Parana Technologies

USA . 474 parts In-Stock

1+ parts

$17.499

100+ parts

-

1k+ parts

$17.693

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474

$17.499

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$17.693

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ChromeModa Solutions

Germany . 6,229 parts In-Stock

1+ parts

$19.662

100+ parts

$16.123

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6,229

$19.662

$16.123

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IDEA Electronic Components Group

UK . 2,326 parts In-Stock

1+ parts

$19.662

100+ parts

$18.679

1k+ parts

$17.696

10k+ parts

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2,326

$19.662

$18.679

$17.696

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Corphita

USA . 2,059 parts In-Stock

1+ parts

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2,059

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DigiPath Technology Company

USA . 1,540 parts In-Stock

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100+ parts

$17.727

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1,540

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$17.727

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Microchip USA

USA . 208 parts In-Stock

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208

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Overview

Unlock the potential of your next project with the LM3S1435-EQC50-A2T by Texas Instruments. As a leader in microcontroller technology, Texas Instruments guarantees top-notch quality and reliability. Whether you're designing a smart home device, robotics project, or industrial automation system, this microcontroller offers unparalleled performance and versatility. With advanced features like ADC channels and PWM capabilities, along with a wide operating temperature range, this product provides exceptional value and benefits to customers looking for cutting-edge solutions. Elevate your designs with the LM3S1435-EQC50-A2T and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a specific voltage range, ensuring reliable performance.

Package Shape: SQUARE

Helps in optimizing space utilization on the circuit board.

Bit Size: 32

Offers sufficient processing power for handling complex tasks.

Power Supplies (V): 2.5, 3.3

Versatile voltage support for compatibility with a wide range of applications.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK

Ensures a compact and convenient form factor for the microcontroller.

Minimum Supply Voltage: 2.25 V

Guarantees stable operation even at lower voltage levels.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with high temperature requirements.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions as well.

Terminal Finish: TIN

Provides corrosion resistance and ensures reliable electrical connections.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with sensors and other analog devices.

Terminal Position: QUAD

Facilitates easy integration into circuit layouts with quad-terminal configuration.

ROM Words: 98304

Offers ample storage capacity for program code and data.

Maximum Seated Height: 1.6 mm

Low profile design for slim and compact electronic devices.

Width: 14 mm

Compact dimensions for space-constrained applications.

Maximum Clock Frequency: 8.192 MHz

Provides fast processing speeds for efficient operation.

Length: 14 mm

Compact dimensions for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient processing and control tasks.

RAM Bytes: 32768

Sufficient RAM capacity for storing and manipulating data during operation.

Technology: CMOS

Provides low power consumption and reliable performance for extended use.

Terminal Form: GULL WING

Facilitates easy soldering and PCB mounting.

Nominal Supply Voltage: 2.5 V

Optimal voltage level for stable and efficient operation.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of outputs.

ROM Programmability: FLASH

Utilizes flash memory for easy and quick reprogramming of the microcontroller.

Terminal Pitch: 0.5 mm

Fine pitch for high-density interconnects on circuit boards.

Moisture Sensitivity Level (MSL): 3

Suitable for handling moderate humidity levels during operation and storage.

Speed: 50 rpm

Provides efficient processing speed for a wide range of applications.

No. of I/O Lines: 46

Offers multiple I/O options for interfacing with external peripherals and devices.

Technical Specifications

Microcontrollers LM3S1435-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1435-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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