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LM3S1435-EQC50-A2

Texas Instruments

LM3S1435-EQC50-A2 by Texas Instruments

LM3S1435-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 46 I/O lines, 32768 RAM bytes, and 98304 ROM words. It operates in industrial temperatures (-40 to 105 °C) and has a max clock frequency of 8.192 MHz. Ideal for applications requiring high-speed processing and multiple PWM channels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,086 parts In-Stock

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Vyrian

USA . 1,908 parts In-Stock

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1,908

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Distributors (Availability)

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One Stop Electronics

USA . 759 parts In-Stock

1+ parts

$1.000

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759

$1.000

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AZTECH Wire

Italy . 434 parts In-Stock

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$13.475

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434

$13.475

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Parana Technologies

USA . 205 parts In-Stock

1+ parts

$28.611

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$49.505

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205

$28.611

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$49.505

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DigiPath Technology Company

USA . 581 parts In-Stock

1+ parts

$31.504

100+ parts

$28.984

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581

$31.504

$28.984

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ChromeModa Solutions

Germany . 4,936 parts In-Stock

1+ parts

$32.147

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$26.361

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4,936

$32.147

$26.361

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IDEA Electronic Components Group

UK . 658 parts In-Stock

1+ parts

$32.147

100+ parts

$30.540

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$28.932

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658

$32.147

$30.540

$28.932

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Corphita

USA . 2,784 parts In-Stock

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Microchip USA

USA . 256 parts In-Stock

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Overview

Elevate your projects with the LM3S1435-EQC50-A2 microcontroller from Texas Instruments, a powerhouse in the industry known for its top-notch quality and reliability. This versatile device is perfect for a wide range of applications, offering customers unparalleled value and performance. With advanced features and capabilities, this microcontroller delivers benefits that will take your projects to the next level. Upgrade to the LM3S1435-EQC50-A2 and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and can withstand various environmental conditions, making the product reliable and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 2.75 V

Operates efficiently at a maximum supply voltage of 2.75V, making it ideal for low-power applications.

Package Shape: SQUARE

Square package shape allows for compact design and efficient use of space on the PCB.

Bit Size: 32

32-bit architecture provides high processing power and performance for complex applications.

Power Supplies (V): 2.5,3.3

Supports multiple power supply voltages, offering flexibility in design and compatibility with different power sources.

No. of Terminals: 100

Ample number of terminals allow for easy connectivity and interfacing with other components in the system.

Package Style (Meter): FLATPACK

Flatpack package style ensures space-saving and efficient heat dissipation for improved reliability.

Minimum Supply Voltage: 2.25 V

Can operate at a low minimum supply voltage of 2.25V, suitable for battery-powered applications.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures up to 105°C, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme low temperatures down to -40°C, ensuring performance in harsh environments.

Terminal Finish: TIN

Tin terminal finish ensures good conductivity and solderability for reliable connections.

ADC Channels: YES

Integrated ADC channels allow for analog signal conversion, enabling sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal position provides ease of soldering and robust mechanical support for the package.

ROM Words: 98304

Large ROM capacity of 98304 words allows for storing firmware and program codes for efficient operation.

Maximum Seated Height: 1.6 mm

Low profile with a maximum seated height of 1.6mm saves space and enables compact designs.

Width: 14 mm

Compact width of 14mm allows for efficient use of PCB space and integration into small form factor devices.

Maximum Clock Frequency: 8.192 MHz

High maximum clock frequency of 8.192MHz enables fast data processing and real-time control applications.

Length: 14 mm

Short length of 14mm contributes to a compact overall package size and space-saving design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture provides efficient processing power, low power consumption, and fast execution of instructions.

RAM Bytes: 32768

Large RAM capacity of 32768 bytes allows for temporary data storage and efficient multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering, mechanical strength, and secure connections on the PCB.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5V ensures consistent and reliable operation in the target application.

PWM Channels: YES

Integrated PWM channels allow for precise control of motor speeds, LED brightness, and power management.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates, reprogramming, and customization of the device's functionality.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and space-efficient PCB layout.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that the product can withstand moderate exposure to moisture during storage and handling.

Speed: 50 rpm

Capable of handling speeds up to 50 revolutions per minute, suitable for applications requiring precise speed control and monitoring.

No. of I/O Lines: 46

Abundance of I/O lines allows for versatile interfacing with external devices, sensors, and peripherals for enhanced functionality.

Technical Specifications

Microcontrollers LM3S1435-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1435-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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