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LM3S1332-IQC50-A2T

Texas Instruments

LM3S1332-IQC50-A2T by Texas Instruments

LM3S1332-IQC50-A2T by Texas Instruments is a 32-bit microcontroller with 16384 bytes of RAM and 98304 ROM words. Operating at a max clock frequency of 0.032 MHz, it features 57 I/O lines and PWM channels for industrial applications requiring a temperature range from -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,399 parts In-Stock

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Vyrian

USA . 2,747 parts In-Stock

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One Stop Electronics

USA . 457 parts In-Stock

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$6.000

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457

$6.000

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AZTECH Wire

Italy . 307 parts In-Stock

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$14.959

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307

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Microchip USA

USA . 3,499 parts In-Stock

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$38.630

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$38.080

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$37.800

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$37.520

3,499

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$38.080

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$37.520

Parana Technologies

USA . 809 parts In-Stock

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$45.501

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809

$45.501

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DigiPath Technology Company

USA . 1,947 parts In-Stock

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$50.102

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ChromeModa Solutions

Germany . 3,080 parts In-Stock

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$51.125

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$41.922

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$51.125

$41.922

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IDEA Electronic Components Group

UK . 114 parts In-Stock

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$51.125

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$48.569

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$46.012

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114

$51.125

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Component Stockers USA

USA . 222 parts In-Stock

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$99.990

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Corphita

USA . 4,779 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S1332-IQC50-A2T microcontroller by Texas Instruments. Crafted with precision and reliability, this powerful device offers unparalleled performance for a wide range of applications. Whether you're creating innovative IoT solutions or designing cutting-edge automation systems, this microcontroller delivers the speed, efficiency, and flexibility you need to bring your ideas to life. Trust Texas Instruments to provide superior quality and value, making the LM3S1332-IQC50-A2T the perfect choice for all your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and space in the production process.

Maximum Supply Voltage: 2.75 V

The low maximum supply voltage helps to prevent damage to the microcontroller and other components in the circuit.

Bit Size: 32

A larger bit size allows for more data to be processed at once, improving the overall performance of the microcontroller.

Power Supplies (V): 2.5,3.3

Having multiple power supply options provides flexibility in designing circuits and allows for compatibility with different power sources.

No. of Terminals: 100

A higher number of terminals allows for more connections to other components, expanding the capabilities of the microcontroller.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows the microcontroller to function in extreme environments, making it suitable for a variety of applications.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to convert analog signals into digital data, expanding its functionality in sensor-based applications.

ROM Words: 98304

The large ROM size allows for storing a substantial amount of code and data, making the microcontroller versatile for different software applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller allows for faster and more efficient processing of instructions, improving overall performance.

RAM Bytes: 16384

A larger RAM size enables the microcontroller to store and access more data quickly, enhancing its ability to handle complex tasks.

Technical Specifications

Microcontrollers LM3S1332-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

57

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1332-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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