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LM3S1332-IBZ50-A2T

Texas Instruments

LM3S1332-IBZ50-A2T by Texas Instruments

LM3S1332-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at a max frequency of 0.032 MHz. It features 16384 bytes of RAM and 98304 ROM words, suitable for industrial applications requiring PWM and ADC channels. With a temperature range from -40 to 85 °C, this CMOS technology-based microcontroller offers versatile performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,375 parts In-Stock

1+ parts

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6,375

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Digiode

USA . 4,829 parts In-Stock

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4,829

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 321 parts In-Stock

1+ parts

$8.945

100+ parts

-

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321

$8.945

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One Stop Electronics

USA . 1,527 parts In-Stock

1+ parts

$18.000

100+ parts

-

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1,527

$18.000

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Microchip USA

USA . 2,112 parts In-Stock

1+ parts

$38.630

100+ parts

$38.080

1k+ parts

$37.800

10k+ parts

$37.520

2,112

$38.630

$38.080

$37.800

$37.520

Parana Technologies

USA . 1,078 parts In-Stock

1+ parts

$43.460

100+ parts

-

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1,078

$43.460

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DigiPath Technology Company

USA . 300 parts In-Stock

1+ parts

$47.855

100+ parts

$44.027

1k+ parts

-

10k+ parts

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300

$47.855

$44.027

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ChromeModa Solutions

Germany . 6,104 parts In-Stock

1+ parts

$48.832

100+ parts

$40.042

1k+ parts

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6,104

$48.832

$40.042

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IDEA Electronic Components Group

UK . 1,844 parts In-Stock

1+ parts

$48.832

100+ parts

$46.390

1k+ parts

$43.949

10k+ parts

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1,844

$48.832

$46.390

$43.949

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Corphita

USA . 203 parts In-Stock

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203

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Overview

Unlock endless possibilities with the Texas Instruments LM3S1332-IBZ50-A2T microcontroller! Crafted with precision and expertise, this innovative device is designed to revolutionize your projects with its advanced capabilities. From smart appliances to robotics, this microcontroller offers unmatched performance and reliability, ensuring seamless operation in a wide range of applications. Experience the value and benefits of cutting-edge technology with the LM3S1332-IBZ50-A2T by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protects the microcontroller from external elements, making it reliable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and effort during manufacturing processes.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation and prevents damage to the microcontroller, making it suitable for low voltage applications.

Package Shape: SQUARE

The square package shape allows for compact design and efficient use of board space, making it ideal for space-constrained applications.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers high computational power and performance for complex tasks and computations.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) allows for versatility in different application requirements, enhancing compatibility and flexibility.

No. of Terminals: 108

The high number of terminals provides ample connectivity options for interfacing with external components and peripherals, enabling diverse functionality and integration possibilities.

Package Style (Meter): GRID ARRAY

The grid array package style offers easy soldering and assembly, ensuring reliable connections and robust mechanical support for the microcontroller.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25V allows for operation in low-power situations without compromising performance, making it energy-efficient and versatile.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can withstand harsh environmental conditions and temperature fluctuations, ensuring reliable operation in tough industrial settings.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C enables reliable performance in cold environments, making it suitable for a wide range of applications in various climatic conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and resistance to corrosion, ensuring reliable connections and long-term functionality of the microcontroller.

ADC Channels: YES

The presence of analog-to-digital converter (ADC) channels allows for interfacing with analog sensors and signals, enabling accurate data acquisition and processing capabilities in the microcontroller.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy mounting and soldering on the PCB, simplifying the assembly process and enhancing mechanical stability.

ROM Words: 98304

With a large ROM capacity of 98304 words, this microcontroller can store and execute complex software programs and algorithms efficiently, enabling versatile application development.

Maximum Seated Height: 1.5 mm

The low maximum seated height of 1.5mm allows for slim and compact designs, minimizing the overall size of the PCB and enabling integration in space-constrained applications.

Width: 10 mm

The width of 10mm offers a compact form factor for the microcontroller, enabling easy integration into various electronic devices and systems with limited space.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 32MHz allows for fast and efficient processing of instructions and data, ensuring high performance and responsiveness in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering and thermal stability during manufacturing processes, preventing damage to the microcontroller.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for effective and secure soldering of the microcontroller, ensuring strong and durable connections in the assembly.

Length: 10 mm

The length of 10mm contributes to the compact size of the microcontroller, making it suitable for applications where space is limited and size constraints are critical.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures reliable operation and performance in harsh industrial environments, making it suitable for critical applications in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The use of RISC (Reduced Instruction Set Computing) architecture in the microcontroller provides efficient and streamlined processing of instructions, enhancing speed and performance for various applications.

RAM Bytes: 16384

With a substantial RAM capacity of 16384 bytes, this microcontroller can efficiently store and process data during runtime, enabling smooth and responsive operation in multitasking scenarios.

Technology: CMOS

The CMOS (Complementary Metal-Oxide-Semiconductor) technology used in the microcontroller offers low power consumption and high noise immunity, making it energy-efficient and reliable for long-term operation.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections for soldering on the PCB, ensuring stable electrical connections and mechanical integrity in harsh operating conditions.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V ensures stable and consistent power delivery to the microcontroller, maintaining reliable operation and preventing voltage fluctuations.

PWM Channels: YES

The presence of Pulse-Width Modulation (PWM) channels enables precise control of signals for applications such as motor control and power management, enhancing flexibility and functionality.

ROM Programmability: FLASH

The ROM programmability with Flash memory allows for easy and quick updates of firmware and software, enabling seamless customization and adaptability of the microcontroller for different application requirements.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8mm provides fine-pitch connections for soldering, ensuring precise and accurate mounting on the PCB and enhancing reliability in high-density board designs.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates moderate sensitivity to moisture during storage and handling, requiring proper care to prevent damage and ensure long-term reliability of the microcontroller.

Speed: 50 rpm

The speed of 50 rotations per minute (rpm) refers to the processing speed and performance capabilities of the microcontroller, indicating efficient execution of instructions and tasks for various applications.

No. of I/O Lines: 57

The high number of input/output (I/O) lines provides extensive connectivity options for interfacing with external devices and peripherals, enabling versatile functionality and integration in complex systems.

Technical Specifications

Microcontrollers LM3S1332-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

57

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1332-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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