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LM3S1332-IBZ50-A2

Texas Instruments

LM3S1332-IBZ50-A2 by Texas Instruments

LM3S1332-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at a max frequency of 0.032 MHz. It features 16384 bytes of RAM and 98304 ROM words, suitable for industrial applications requiring PWM channels and ADC functionality. With a temperature range from -40 to 85 °C, this microcontroller is ideal for various RISC-based projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,487 parts In-Stock

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7,487

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Digiode

USA . 770 parts In-Stock

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770

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,634 parts In-Stock

1+ parts

$8.000

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1,634

$8.000

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AZTECH Wire

Italy . 683 parts In-Stock

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$16.253

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683

$16.253

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One Stop Electronics

USA . 994 parts In-Stock

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$24.000

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994

$24.000

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Microchip USA

USA . 2,641 parts In-Stock

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$47.220

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$46.550

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$46.210

10k+ parts

$45.870

2,641

$47.220

$46.550

$46.210

$45.870

Parana Technologies

USA . 799 parts In-Stock

1+ parts

$54.424

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799

$54.424

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ChromeModa Solutions

Germany . 3,142 parts In-Stock

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$61.151

100+ parts

$50.144

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3,142

$61.151

$50.144

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IDEA Electronic Components Group

UK . 436 parts In-Stock

1+ parts

$61.151

100+ parts

$58.093

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$55.036

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436

$61.151

$58.093

$55.036

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Component Stockers USA

USA . 518 parts In-Stock

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$99.990

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518

$99.990

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Corphita

USA . 2,035 parts In-Stock

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2,035

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DigiPath Technology Company

USA . 742 parts In-Stock

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$55.134

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742

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$55.134

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Overview

Discover the LM3S1332-IBZ50-A2 by Texas Instruments, a cutting-edge microcontroller that offers exceptional quality and reliability. With a wide range of applications in various industries, this product provides unmatched value and benefits to customers. From its advanced technology to its innovative features, this microcontroller is designed to optimize performance and efficiency. Trust in Texas Instruments, a renowned manufacturer with a reputation for excellence, and elevate your projects to new heights with the LM3S1332-IBZ50-A2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the package body, making the product resistant to environmental factors.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort in the production process.

Maximum Supply Voltage: 2.75 V

Operating within the maximum supply voltage limit ensures the safety and stability of the microcontroller, preventing damage from overvoltage.

Package Shape: SQUARE

The square package shape makes the microcontroller compact and space-efficient, suitable for applications with limited board space.

Bit Size: 32

A 32-bit architecture allows for increased processing power and performance, making the microcontroller suitable for complex applications that require high computational capabilities.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages provides flexibility in system design and compatibility with various power sources.

No. of Terminals: 108

Having a higher number of terminals increases connectivity options and allows for interfacing with multiple external components, enhancing the versatility of the microcontroller.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates efficient heat dissipation and improves thermal performance, ensuring the reliability of the microcontroller during operation.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the microcontroller can function in extreme cold environments without compromising performance.

ADC Channels: YES

Integrated Analog-to-Digital Converter (ADC) channels enable the microcontroller to interface with analog sensors and signals, expanding its range of applications in data acquisition and processing.

ROM Words: 98304

A large ROM capacity of 98304 words allows for storing extensive program code, data, and configuration settings, making the microcontroller suitable for complex applications with high memory requirements.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in harsh industrial environments with temperature fluctuations and variations.

RAM Bytes: 16384

With 16384 bytes of Random Access Memory (RAM), the microcontroller can efficiently handle data storage and retrieval tasks, enhancing its processing capabilities for multitasking applications.

Technology: CMOS

Utilizing Complementary Metal-Oxide-Semiconductor (CMOS) technology ensures low power consumption and high noise immunity, contributing to the energy efficiency and reliability of the microcontroller.

PWM Channels: YES

Support for Pulse Width Modulation (PWM) channels enables precise control of analog outputs, making the microcontroller suitable for applications requiring accurate motor control or LED dimming.

ROM Programmability: FLASH

The programmable Flash memory allows for in-circuit reprogramming of the ROM, enabling firmware updates and customization without needing to replace the microcontroller chip.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the microcontroller can withstand occasional exposure to moisture during handling and assembly processes without compromising its functionality.

No. of I/O Lines: 57

With 57 Input/Output (I/O) lines, the microcontroller offers ample connectivity options for interfacing with external devices and peripherals, enhancing its flexibility in system integration.

Technical Specifications

Microcontrollers LM3S1332-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

57

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1332-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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